Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334414 | Power semiconductor device with dual heat dissipation structures | Angel Enverga, Chii Shang Hong, Chee Ming Lam, Sanjay Kumar Murugan, Subaramaniym Senivasan | 2025-06-17 |
| 11984392 | Semiconductor package having a chip carrier with a pad offset feature | Chee Yang Ng, Stefan Woetzel, Edward Fuergut, Thai Kee Gan, Chee Hong Lee +1 more | 2024-05-14 |
| 11908771 | Power semiconductor device with dual heat dissipation structures | Angel Enverga, Chii Shang Hong, Chee Ming Lam, Sanjay Kumar Murugan, Subaramaniym Senivasan | 2024-02-20 |
| 11362023 | Package lead design with grooves for improved dambar separation | Meng How Chong, Elmer Senorin Holgado, Chee Ming Lam, Sanjay Kumar Murugan, Arivindran Navaretnasinggam +2 more | 2022-06-14 |
| 11274984 | Pressure sensor having a lidless/laminate structure | Chau Fatt Chiang, Paul Armand Asentista Calo, Chan Lam Cha, Kok Yau Chua, Jo Ean Chye +4 more | 2022-03-15 |
| 10651109 | Selective plating of semiconductor package leads | Syahir Abd Hamid, Jagen Krishnan, Mian Mian Lam, Fabian Schnoy, Thomas Stoek +1 more | 2020-05-12 |
| 10457001 | Method for forming a matrix composite layer and workpiece with a matrix composite layer | Jagen Krishnan, Sanjay Kumar Murugan, Hong Lim Lee | 2019-10-29 |
| 10121723 | Semiconductor component and method for producing a semiconductor component | Kok Tee Lau | 2018-11-06 |