CN

Chee Yang Ng

Infineon Technologies Ag: 19 patents #423 of 7,486Top 6%
IA Infineon Technologies Austria Ag: 3 patents #336 of 1,126Top 30%
Overall (All Time): #188,375 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12412797 Hybrid embedded package Stefan Woetzel 2025-09-09
12232302 Dipped coated electronic module assembly with enhanced thermal distribution Swee Kah Lee 2025-02-18
12150236 Voltage regulator module with inductor-cooled power stage Gerald Deboy, Kok Yau Chua, Angela Kessler, Kennith Kin Leong, Luca Peluso 2024-11-19
12136583 Method of forming a chip package, method of forming a semiconductor arrangement, chip package, and semiconductor arrangement 2024-11-05
12094807 Stacked transistor chip package with source coupling Sergey Yuferev, Paul Armand Asentista Calo, Theng Chao Long, Josef Maerz, Petteri Palm +1 more 2024-09-17
11984392 Semiconductor package having a chip carrier with a pad offset feature Stefan Woetzel, Edward Fuergut, Thai Kee Gan, Chee Hong Lee, Jayaganasan Narayanasamy +1 more 2024-05-14
11676879 Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier Stefan Woetzel 2023-06-13
11521907 Hybrid embedded package Stefan Woetzel 2022-12-06
11393743 Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation Stuart Cardwell, Josef Maerz, Clive O'Dell, Mark Pavier 2022-07-19
11289436 Semiconductor package having a laser-activatable mold compound Chee Hong Lee, Kok Yau Chua, Chii Shang Hong, Swee Kah Lee, Klaus Schiess 2022-03-29
11174152 Over-under sensor packaging with sensor spaced apart from control chip Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee 2021-11-16
11039231 Package with acoustic sensing device(s) and millimeter wave sensing elements Kok Yau Chua 2021-06-15
10770399 Semiconductor package having a filled conductive cavity Hock Siang Chua, Stefan Macheiner, Josef Maerz, Nurfarena Othman, Joseph Victor Soosai Prakasam +1 more 2020-09-08
10549985 Semiconductor package with a through port for sensor applications Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller +5 more 2020-02-04
10501312 Over-under sensor packaging with sensor spaced apart from control chip Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee 2019-12-10
10304780 Device having substrate with conductive pillars Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Valentyn Solomko 2019-05-28
10224260 Semiconductor package with air gap 2019-03-05
10163812 Device having substrate with conductive pillars Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Valentyn Solomko 2018-12-25
10109592 Semiconductor chip with electrically conducting layer 2018-10-23
9868632 Molded cavity package with embedded conductive layer and enhanced sealing Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Horst Theuss 2018-01-16
9628918 Semiconductor device and a method for forming a semiconductor device 2017-04-18
9117807 Integrated passives package, semiconductor module and method of manufacturing 2015-08-25