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Stefan Woetzel |
2023-06-13 |
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Hybrid embedded package |
Stefan Woetzel |
2022-12-06 |
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Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation |
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2022-07-19 |
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Chee Hong Lee, Kok Yau Chua, Chii Shang Hong, Swee Kah Lee, Klaus Schiess |
2022-03-29 |
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Over-under sensor packaging with sensor spaced apart from control chip |
Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee |
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Kok Yau Chua |
2021-06-15 |
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| 10549985 |
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Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller +5 more |
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Over-under sensor packaging with sensor spaced apart from control chip |
Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee |
2019-12-10 |
| 10304780 |
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Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Valentyn Solomko |
2019-05-28 |
| 10224260 |
Semiconductor package with air gap |
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2019-03-05 |
| 10163812 |
Device having substrate with conductive pillars |
Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Valentyn Solomko |
2018-12-25 |
| 10109592 |
Semiconductor chip with electrically conducting layer |
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2018-10-23 |
| 9868632 |
Molded cavity package with embedded conductive layer and enhanced sealing |
Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Horst Theuss |
2018-01-16 |
| 9628918 |
Semiconductor device and a method for forming a semiconductor device |
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2017-04-18 |
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Integrated passives package, semiconductor module and method of manufacturing |
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2015-08-25 |