Issued Patents All Time
Showing 25 most recent of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368111 | Semiconductor apparatuses with radio-frequency line elements, and associated manufacturing methods | Walter Hartner, Thomas Kilger, Johannes Lodermeyer, Franz-Xaver Muehlbauer, Martin Richard Niessner +1 more | 2025-07-22 |
| 12158448 | Radiation source device | Derek Debie, Klaus Elian, Ludwig Heitzer, David Tumpold, Jens Pohl +3 more | 2024-12-03 |
| 12040543 | Radio-frequency devices and methods for producing radio-frequency devices | Walter Hartner, Tuncay ERDOEL, Klaus Elian, Bernhard Rieder, Rainer Markus Schaller +2 more | 2024-07-16 |
| 11955462 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Sven Albers, Andreas Wolter, Marc Dittes +1 more | 2024-04-09 |
| 11505450 | Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package | Florian BRANDL, Robert Gruenberger, Claus Waechter, Bernhard Winkler | 2022-11-22 |
| 11424209 | Wafer level package structure with internal conductive layer | Sven Albers, Klaus Reingruber, Georg Seidemann, Richard Patten | 2022-08-23 |
| 11376998 | Fastening device for a child's seat in a motor vehicle, and motor vehicle with such a fastening device | Uemit Kilincsoy | 2022-07-05 |
| 11239199 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Sven Albers, Andreas Wolter, Marc Dittes +1 more | 2022-02-01 |
| 11145563 | Semiconductor devices having cutouts in an encapsulation material and associated production methods | Walter Hartner, Claus Waechter, Maciej Wojnowski | 2021-10-12 |
| 10916484 | Electronic device including redistribution layer pad having a void | Robert Fehler, Francesca Arcioni, Walter Hartner, Gerhard Haubner, Thorsten Meyer +2 more | 2021-02-09 |
| 10899604 | Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package | Florian BRANDL, Robert Gruenberger, Claus Waechter, Bernhard Winkler | 2021-01-26 |
| 10854590 | Semiconductor die package with more than one hanging die | Sven Albers, Klaus Reingruber, Richard Patten, Georg Seidemann | 2020-12-01 |
| 10816742 | Integrated circuit packages including an optical redistribution layer | Georg Seidemann, Sven Albers, Thomas Wagner, Marc Dittes, Klaus Reingruber +2 more | 2020-10-27 |
| 10793429 | Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly | Matthias Steiert, Karolina Zogal | 2020-10-06 |
| 10741486 | Electronic components having three-dimensional capacitors in a metallization stack | Klaus Reingruber, Sven Albers | 2020-08-11 |
| 10672731 | Wafer level package structure with internal conductive layer | Sven Albers, Klaus Reingruber, Georg Seidemann, Richard Patten | 2020-06-02 |
| 10651102 | Interposer with conductive routing exposed on sidewalls | Klaus Reingruber, Georg Seidemann, Sonja Koller | 2020-05-12 |
| 10584028 | Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly | Matthias Steiert, Karolina Zogal | 2020-03-10 |
| 10553538 | Semiconductor package having a variable redistribution layer thickness | Klaus Reingruber, Sven Albers, Georg Seidemann, Bernd Waidhas, Thomas Wagner +1 more | 2020-02-04 |
| 10549985 | Semiconductor package with a through port for sensor applications | Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Bernd Goller, Thomas Kilger +5 more | 2020-02-04 |
| 10522454 | Microelectronic package having a passive microelectronic device disposed within a package body | Thorsten Meyer, Gerald Ofner, Andreas Wolter, Georg Seidemann, Sven Albers | 2019-12-31 |
| 10522485 | Electrical device and a method for forming an electrical device | Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber, Thomas Wagner +1 more | 2019-12-31 |
| 10490527 | Vertical wire connections for integrated circuit package | Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber, Thomas Wagner +1 more | 2019-11-26 |
| 10442457 | Steering column having an adaptable pivot support | Eric Gstöhl, Sven Hausknecht, Stefan-Hermann Loos, Frank Pasch | 2019-10-15 |
| 10446541 | Advanced node cost reduction by ESD interposer | Georg Seidemann, Klaus Reingruber | 2019-10-15 |