Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12249553 | Thermal contacts at periphery of integrated circuit packages | Vishnu Prasad, Georg Seidemann | 2025-03-11 |
| 11877403 | Printed wiring-board islands for connecting chip packages and methods of assembling same | Georg Seidemann, Bernd Waidhas | 2024-01-16 |
| 11784143 | Single metal cavity antenna in package connected to an integrated transceiver front-end | Kilian Roth, Josef Hagn, Andreas Wolter, Andreas Augustin | 2023-10-10 |
| 11764187 | Semiconductor packages, and methods for forming semiconductor packages | Bernd Waidhas, Georg Seidemann, Thomas Wagner, Andreas Wolter, Andreas Augustin +2 more | 2023-09-19 |
| 11646498 | Package integrated cavity resonator antenna | Kilian Roth, Josef Hagn, Andreas Wolter, Andreas Augustin | 2023-05-09 |
| 11456116 | Magnetic coils in locally thinned silicon bridges and methods of assembling same | Andreas Augustin, Bernd Waidhas, Reinhard Mahnkopf, Georg Seidemann | 2022-09-27 |
| 11410908 | Integrated circuit devices with front-end metal structures | Reinhard Mahnkopf, Andreas Wolter | 2022-08-09 |
| 11374323 | Patch antennas stitched to systems in packages and methods of assembling same | Andreas Augustin, Bernd Waidhas, Georg Seidemann, Andreas Wolter, Stephan Stoeckl +2 more | 2022-06-28 |
| 11145577 | Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus | Georg Seidemann, Reinhard Mahnkopf, Bernd Waidhas | 2021-10-12 |
| 11134573 | Printed wiring-board islands for connecting chip packages and methods of assembling same | Georg Seidemann, Bernd Waidhas | 2021-09-28 |
| 11037855 | Contoured-on-heat-sink, wrapped printed wiring boards for system-in-package apparatus | Reinhard Mahnkopf | 2021-06-15 |
| 10658201 | Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor device | Georg Seidemann, Bernd Waidhas | 2020-05-19 |
| 10651102 | Interposer with conductive routing exposed on sidewalls | Klaus Reingruber, Christian Geissler, Georg Seidemann | 2020-05-12 |
| 10629731 | Power mesh-on-die trace bumping | Bernd Waidhas, Georg Seidemann | 2020-04-21 |
| 10535578 | Semiconductor devices, and a method for forming a semiconductor device | Reinhard Mahnkopf, Andreas Wolter | 2020-01-14 |
| 10373844 | Integrated circuit package configurations to reduce stiffness | Sven Albers, Thorsten Meyer, Georg Seidemann, Christian Geissler, Andreas Wolter | 2019-08-06 |
| 10347558 | Low thermal resistance hanging die package | Christian Geissler, Georg Seidemann, Jan Proschwitz | 2019-07-09 |
| 10263106 | Power mesh-on-die trace bumping | Bernd Waidhas, Georg Seidemann | 2019-04-16 |
| 10121726 | Cooler for semiconductor devices | Sven Albers, Klaus Reingruber, Andreas Wolter, Georg Seidemann, Christian Geissler +1 more | 2018-11-06 |
| 10091866 | Device with switchable heat path | Georg Seidemann, Vishnu Prasad | 2018-10-02 |
| 9921694 | Wearable computing device | Sven Albers, Klaus Reingruber, Teodora Ossiander, Andreas Wolter, Georg Seidemann +3 more | 2018-03-20 |
| 9653324 | Integrated circuit package configurations to reduce stiffness | Sven Albers, Thorsten Meyer, Georg Seidemann, Christian Geissler, Andreas Wolter | 2017-05-16 |
| 9397019 | Integrated circuit package configurations to reduce stiffness | Sven Albers, Thorsten Meyer, Georg Seidemann, Christian Geissler, Andreas Wolter | 2016-07-19 |
| 9368461 | Contact pads for integrated circuit packages | Sven Albers, Georg Seidemann, Stephan Stoeckl, Shubhada H. Sahasrabudhe, Sandeep B. Sane | 2016-06-14 |