| 12249553 |
Thermal contacts at periphery of integrated circuit packages |
Vishnu Prasad, Georg Seidemann |
2025-03-11 |
|
| 11877403 |
Printed wiring-board islands for connecting chip packages and methods of assembling same |
Georg Seidemann, Bernd Waidhas |
2024-01-16 |
$42,805,000 |
| 11784143 |
Single metal cavity antenna in package connected to an integrated transceiver front-end |
Kilian Roth, Josef Hagn, Andreas Wolter, Andreas Augustin |
2023-10-10 |
$20,947,000 |
| 11764187 |
Semiconductor packages, and methods for forming semiconductor packages |
Bernd Waidhas, Georg Seidemann, Thomas Wagner, Andreas Wolter, Andreas Augustin +2 more |
2023-09-19 |
$20,015,000 |
| 11646498 |
Package integrated cavity resonator antenna |
Kilian Roth, Josef Hagn, Andreas Wolter, Andreas Augustin |
2023-05-09 |
$19,706,000 |
| 11456116 |
Magnetic coils in locally thinned silicon bridges and methods of assembling same |
Andreas Augustin, Bernd Waidhas, Reinhard Mahnkopf, Georg Seidemann |
2022-09-27 |
$23,391,000 |
| 11410908 |
Integrated circuit devices with front-end metal structures |
Reinhard Mahnkopf, Andreas Wolter |
2022-08-09 |
$13,688,000 |
| 11374323 |
Patch antennas stitched to systems in packages and methods of assembling same |
Andreas Augustin, Bernd Waidhas, Georg Seidemann, Andreas Wolter, Stephan Stoeckl +2 more |
2022-06-28 |
$15,065,000 |
| 11145577 |
Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus |
Georg Seidemann, Reinhard Mahnkopf, Bernd Waidhas |
2021-10-12 |
$32,982,000 |
| 11134573 |
Printed wiring-board islands for connecting chip packages and methods of assembling same |
Georg Seidemann, Bernd Waidhas |
2021-09-28 |
$36,743,000 |
| 11037855 |
Contoured-on-heat-sink, wrapped printed wiring boards for system-in-package apparatus |
Reinhard Mahnkopf |
2021-06-15 |
|
| 10658201 |
Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor device |
Georg Seidemann, Bernd Waidhas |
2020-05-19 |
|
| 10651102 |
Interposer with conductive routing exposed on sidewalls |
Klaus Reingruber, Christian Geissler, Georg Seidemann |
2020-05-12 |
|
| 10629731 |
Power mesh-on-die trace bumping |
Bernd Waidhas, Georg Seidemann |
2020-04-21 |
|
| 10535578 |
Semiconductor devices, and a method for forming a semiconductor device |
Reinhard Mahnkopf, Andreas Wolter |
2020-01-14 |
|
| 10373844 |
Integrated circuit package configurations to reduce stiffness |
Sven Albers, Thorsten Meyer, Georg Seidemann, Christian Geissler, Andreas Wolter |
2019-08-06 |
|
| 10347558 |
Low thermal resistance hanging die package |
Christian Geissler, Georg Seidemann, Jan Proschwitz |
2019-07-09 |
|
| 10263106 |
Power mesh-on-die trace bumping |
Bernd Waidhas, Georg Seidemann |
2019-04-16 |
|
| 10121726 |
Cooler for semiconductor devices |
Sven Albers, Klaus Reingruber, Andreas Wolter, Georg Seidemann, Christian Geissler +1 more |
2018-11-06 |
|
| 10091866 |
Device with switchable heat path |
Georg Seidemann, Vishnu Prasad |
2018-10-02 |
|
| 9921694 |
Wearable computing device |
Sven Albers, Klaus Reingruber, Teodora Ossiander, Andreas Wolter, Georg Seidemann +3 more |
2018-03-20 |
$13,809,000 |
| 9653324 |
Integrated circuit package configurations to reduce stiffness |
Sven Albers, Thorsten Meyer, Georg Seidemann, Christian Geissler, Andreas Wolter |
2017-05-16 |
|
| 9397019 |
Integrated circuit package configurations to reduce stiffness |
Sven Albers, Thorsten Meyer, Georg Seidemann, Christian Geissler, Andreas Wolter |
2016-07-19 |
|
| 9368461 |
Contact pads for integrated circuit packages |
Sven Albers, Georg Seidemann, Stephan Stoeckl, Shubhada H. Sahasrabudhe, Sandeep B. Sane |
2016-06-14 |
$9,885,000 |
