Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469185 | Standoff members for semiconductor package | Je-Young Chang, Tannaz Harirchian | 2022-10-11 |
| 11276625 | Methods of forming flexure based cooling solutions for package structures | Siddarth Kumar, Sandeep B. Sane, Shalabh Tandon | 2022-03-15 |
| 10181432 | Computing system with a thermal interface comprising magnetic particles | Ameya Limaye, Nachiket R. Raravikar | 2019-01-15 |
| 10177066 | Flexible integrated heat spreader | Ameya Limaye | 2019-01-08 |
| 9953934 | Warpage controlled package and method for same | Siddarth Kumar, Sandeep B. Sane, Shalabh Tandon | 2018-04-24 |
| 9659908 | Systems and methods for package on package through mold interconnects | Sandeep B. Sane, Siddarth Kumar, Shalabh Tandon | 2017-05-23 |
| 9368461 | Contact pads for integrated circuit packages | Sven Albers, Georg Seidemann, Sonja Koller, Stephan Stoeckl, Sandeep B. Sane | 2016-06-14 |
| 7411296 | Method, system, and apparatus for gravity assisted chip attachment | Nitin A. Deshpande | 2008-08-12 |