Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11276625 | Methods of forming flexure based cooling solutions for package structures | Siddarth Kumar, Shubhada H. Sahasrabudhe, Sandeep B. Sane | 2022-03-15 |
| 9953934 | Warpage controlled package and method for same | Siddarth Kumar, Sandeep B. Sane, Shubhada H. Sahasrabudhe | 2018-04-24 |
| 9659908 | Systems and methods for package on package through mold interconnects | Shubhada H. Sahasrabudhe, Sandeep B. Sane, Siddarth Kumar | 2017-05-23 |
| 7518091 | Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted material | Mitesh Patel | 2009-04-14 |
| 7119314 | Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted material | Mitesh Patel | 2006-10-10 |