| 7776657 |
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same |
Ashay Dani, Anna M. Prakash, Saikumar Jayaraman, Vijay Wakharkar |
2010-08-17 |
| 7584536 |
Process for precise alignment of packaging caps on a substrate |
Gregory S. Clemons |
2009-09-08 |
| 7518091 |
Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted material |
Shalabh Tandon |
2009-04-14 |
| 7332807 |
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same |
Ashay Dani, Anna M. Prakash, Saikumar Jayaraman, Vijay Wakharkar |
2008-02-19 |
| 7291548 |
Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same |
Daewoong Suh, Saikumar Jayaraman, Stephen Lehman, Tiffany Byrne, Edward L. Martin +4 more |
2007-11-06 |
| 7275312 |
Apparatus for precise alignment of packaging caps on a substrate |
Gregory S. Clemons |
2007-10-02 |
| 7253088 |
Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same |
Daewoong Suh, Saikumar Jayaraman, Stephen Lehman, Tiffany Byrne, Edward L. Martin +4 more |
2007-08-07 |
| 7179689 |
Package stress management |
James C. Matayabas, Jr., Gudbjorg H. Oskarsdottir |
2007-02-20 |
| 7170188 |
Package stress management |
James C. Matayabas, Jr., Gudbjorg H. Oskarsdottir |
2007-01-30 |
| 7119314 |
Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted material |
Shalabh Tandon |
2006-10-10 |