Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7776657 | Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same | Ashay Dani, Anna M. Prakash, Saikumar Jayaraman, Vijay Wakharkar | 2010-08-17 |
| 7584536 | Process for precise alignment of packaging caps on a substrate | Gregory S. Clemons | 2009-09-08 |
| 7518091 | Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted material | Shalabh Tandon | 2009-04-14 |
| 7332807 | Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same | Ashay Dani, Anna M. Prakash, Saikumar Jayaraman, Vijay Wakharkar | 2008-02-19 |
| 7291548 | Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same | Daewoong Suh, Saikumar Jayaraman, Stephen Lehman, Tiffany Byrne, Edward L. Martin +4 more | 2007-11-06 |
| 7275312 | Apparatus for precise alignment of packaging caps on a substrate | Gregory S. Clemons | 2007-10-02 |
| 7253088 | Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same | Daewoong Suh, Saikumar Jayaraman, Stephen Lehman, Tiffany Byrne, Edward L. Martin +4 more | 2007-08-07 |
| 7179689 | Package stress management | James C. Matayabas, Jr., Gudbjorg H. Oskarsdottir | 2007-02-20 |
| 7170188 | Package stress management | James C. Matayabas, Jr., Gudbjorg H. Oskarsdottir | 2007-01-30 |
| 7119314 | Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted material | Shalabh Tandon | 2006-10-10 |