Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Mitesh Patel — 10 Patents

Intel: 10 patents #4,072 of 30,777Top 15%
Chandler, AZ: #579 of 3,331 inventorsTop 20%
Arizona: #3,693 of 32,909 inventorsTop 15%
Overall (All Time): #481,000 of 4,157,543Top 15%
10 Patents All Time
Mitesh Patel has been granted 10 US patents while listed as an inventor at Intel. The first was granted in 2006 and the most recent in August 2010. Mitesh Patel ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Mitesh Patel in Chandler, AZ, US.

Patents per Year

Patents granted per year, 2006 to 2010Bar chart with a peak of 5 patents in 2007.peak 52006: 1 patents20062007: 5 patents20072008: 1 patents20082009: 2 patents20092010: 1 patents2010

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
7776657 Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same Ashay Dani, Anna M. Prakash, Saikumar Jayaraman, Vijay Wakharkar 2010-08-17 $11,574,000
7584536 Process for precise alignment of packaging caps on a substrate Gregory S. Clemons 2009-09-08 $22,439,000
7518091 Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted material Shalabh Tandon 2009-04-14 $13,316,000
7332807 Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same Ashay Dani, Anna M. Prakash, Saikumar Jayaraman, Vijay Wakharkar 2008-02-19 $15,849,000
7291548 Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same Daewoong Suh, Saikumar Jayaraman, Stephen Lehman, Tiffany Byrne, Edward L. Martin +4 more 2007-11-06 $20,355,000
7275312 Apparatus for precise alignment of packaging caps on a substrate Gregory S. Clemons 2007-10-02 $20,761,000
7253088 Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same Daewoong Suh, Saikumar Jayaraman, Stephen Lehman, Tiffany Byrne, Edward L. Martin +4 more 2007-08-07 $27,562,000
7179689 Package stress management James C. Matayabas, Jr., Gudbjorg H. Oskarsdottir 2007-02-20 $9,940,000
7170188 Package stress management James C. Matayabas, Jr., Gudbjorg H. Oskarsdottir 2007-01-30 $14,098,000
7119314 Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted material Shalabh Tandon 2006-10-10 $14,351,000