Issued Patents All Time
Showing 1–25 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11881440 | Carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bonds | Marely E. Tejeda Ferrari, Taylor Gaines, Elah Bozorg-Grayeli | 2024-01-23 |
| 11679407 | Liquid metal thermal interface material application | Kyle Arrington, Joseph Petrini, Aaron McCann, Shankar Devasenathipathy, Mostafa Aghazadeh +1 more | 2023-06-20 |
| 11562940 | Integrated heat spreader comprising a silver and sintering silver layered structure | Elizabeth Nofen, Yawei Liang, Yiqun Bai | 2023-01-24 |
| 11404349 | Multi-chip packages and sinterable paste for use with thermal interface materials | Nachiket R. Raravikar, Ravindranath V. Mahajan, Robert L. Sankman, Ken Hackenberg, Nayandeep K. Mahanta +1 more | 2022-08-02 |
| 10586779 | LPS solder paste based low cost fine pitch pop interconnect solutions | Nachiket R. Raravikar, Akshay Mathkar | 2020-03-10 |
| 10580717 | Multiple-chip package with multiple thermal interface materials | Boxi LIU, Hemanth K. Dhavaleswarapu, Syadwad Jain | 2020-03-03 |
| 10056314 | Polymer thermal interface material having enhanced thermal conductivity | Randall D. Lowe, Jr., Syadwad Jain | 2018-08-21 |
| 9950393 | Hybrid low metal loading flux | Rajen S. Sidhu, Martha A. Dudek, Michelle S. Phen, Wei Tan | 2018-04-24 |
| 9941652 | Space transformer with perforated metallic plate for electrical die test | Nachiket R. Raravikar, Akshay Mathkar, Dingying Xu | 2018-04-10 |
| 9831206 | LPS solder paste based low cost fine pitch pop interconnect solutions | Nachiket R. Raravikar, Akshay Mathkar | 2017-11-28 |
| 9640415 | Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials | Randall D. Lowe, Jr., Suriyakala Ramalingam, Nisha Ananthakrishnan, Arjun Krishnan, Hitesh Arora | 2017-05-02 |
| 9631065 | Methods of forming wafer level underfill materials and structures formed thereby | Anna M. Prakash, Arjun Krishnan, Nisha Ananthakrishnan | 2017-04-25 |
| 9070660 | Polymer thermal interface material having enhanced thermal conductivity | Randall D. Lowe, Jr., Syadwad Jain | 2015-06-30 |
| 8920919 | Thermal interface material composition including polymeric matrix and carbon filler | Hitesh Arora | 2014-12-30 |
| 8901716 | Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin | — | 2014-12-02 |
| 8900919 | Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials | Randall D. Lowe, Jr., Suriyakala Ramalingam, Nisha Ananthakrishnan, Arjun Krishnan, Hitesh Arora | 2014-12-02 |
| 8431223 | Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications | Tian-An Chen | 2013-04-30 |
| 8431673 | Radiation curable compositions | Zhikai Wang, Christopher W. Miller, Marcus Lee Hutchins | 2013-04-30 |
| 8242216 | Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications | Tian-An Chen | 2012-08-14 |
| 7999042 | Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications | Tian-An Chen | 2011-08-16 |
| 7816171 | Component packaging apparatus, systems, and methods | Paul A. Koning | 2010-10-19 |
| 7794623 | Microelectronic device having liquid crystalline epoxy resins | Paul A. Koning | 2010-09-14 |
| 7744802 | Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin | — | 2010-06-29 |
| 7723160 | Thermal interface structure with integrated liquid cooling and methods | Sabina J. Houle | 2010-05-25 |
| 7700943 | In-situ functionalization of carbon nanotubes | Nachiket R. Raravikar | 2010-04-20 |