Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9950393 | Hybrid low metal loading flux | Rajen S. Sidhu, Martha A. Dudek, James C. Matayabas, Jr., Wei Tan | 2018-04-24 |
| 9431274 | Method for reducing underfill filler settling in integrated circuit packages | Suriyakala Ramalingam, Manish Dubey, Hsin-Yu Li, Hitesh Arora, Nisha Ananthakrishnan +3 more | 2016-08-30 |