Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176268 | Open cavity bridge co-planar placement architectures and processes | Omkar G. Karhade, Digvijay A. Raorane, Sairam Agraharam, Nitin A. Deshpande, Mitul Modi +1 more | 2024-12-24 |
| 12176292 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba +1 more | 2024-12-24 |
| 11887962 | Microelectronic structures including bridges | Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia, Sairam Agraharam, Edvin Cetegen +6 more | 2024-01-30 |
| 11817390 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba +1 more | 2023-11-14 |
| 11798861 | Integrated heat spreader (IHS) with heating element | Peng Li, Kelly Lofgreen, Bamidele Daniel Falola, Ken Hackenberg, Shenavia S. Howell +3 more | 2023-10-24 |
| 11791274 | Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects | Omkar G. Karhade, Nitin A. Deshpande, Jinhe Liu, Sairam Agraharam, Mohit Bhatia +1 more | 2023-10-17 |
| 11670569 | Channeled lids for integrated circuit packages | Amitesh Saha, Marco Aurelio Cartas, Peng Li, Bamidele Daniel Falola | 2023-06-06 |
| 11640942 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba +1 more | 2023-05-02 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more | 2023-01-03 |
| 11302643 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba +1 more | 2022-04-12 |
| 10651108 | Foam composite | Zhizhong Tang, Syadwad Jain, Wei Hu, Michael A. Schroeder, Rajen S. Sidhu +3 more | 2020-05-12 |
| 10535615 | Electronic package that includes multi-layer stiffener | Srikant Nekkanty, Rajendra C. Dias, Patrick Nardi | 2020-01-14 |
| 10206277 | Gradient encapsulant protection of devices in stretchable electronics | Rajendra C. Dias, Tatyana N. Andryushchenko, Aleksandar Aleksov, David Staines | 2019-02-12 |
| 9887104 | Electronic package and method of connecting a first die to a second die to form an electronic package | Rajendra C. Dias, Patrick Nardi, David Woodhams | 2018-02-06 |
| 9721906 | Electronic package with corner supports | Rajendra C. Dias, Baris Bicen, Digvijay A. Raorane, Bharat P. Penmecha | 2017-08-01 |
| 9508660 | Microelectronic die having chamfered corners | Emre Armagan, Rajendra C. Dias, Lars D. Skoglund | 2016-11-29 |
| 9431274 | Method for reducing underfill filler settling in integrated circuit packages | Suriyakala Ramalingam, Hsin-Yu Li, Michelle S. Phen, Hitesh Arora, Nisha Ananthakrishnan +3 more | 2016-08-30 |
| 9230833 | Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures | Rajendra C. Dias, Yonghao Xiu, Arjun Krishnan, Yiqun Bai, Purushotham Kaushik Muthur Srinath | 2016-01-05 |
| 8999765 | Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures | Rajendra C. Dias, Yonghao Xiu, Arjun Krishnan, Yiqun Bai, Purushotham Kaushik Muthur Srinath | 2015-04-07 |