| 12176268 |
Open cavity bridge co-planar placement architectures and processes |
Omkar G. Karhade, Digvijay A. Raorane, Sairam Agraharam, Nitin A. Deshpande, Mitul Modi +1 more |
2024-12-24 |
$17,261,000 |
| 12176292 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba +1 more |
2024-12-24 |
$17,261,000 |
| 11887962 |
Microelectronic structures including bridges |
Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia, Sairam Agraharam, Edvin Cetegen +6 more |
2024-01-30 |
$30,721,000 |
| 11817390 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba +1 more |
2023-11-14 |
$31,444,000 |
| 11798861 |
Integrated heat spreader (IHS) with heating element |
Peng Li, Kelly Lofgreen, Bamidele Daniel Falola, Ken Hackenberg, Shenavia S. Howell +3 more |
2023-10-24 |
$20,059,000 |
| 11791274 |
Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects |
Omkar G. Karhade, Nitin A. Deshpande, Jinhe Liu, Sairam Agraharam, Mohit Bhatia +1 more |
2023-10-17 |
$15,641,000 |
| 11670569 |
Channeled lids for integrated circuit packages |
Amitesh Saha, Marco Aurelio Cartas, Peng Li, Bamidele Daniel Falola |
2023-06-06 |
$21,341,000 |
| 11640942 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba +1 more |
2023-05-02 |
$21,235,000 |
| 11545407 |
Thermal management solutions for integrated circuit packages |
Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more |
2023-01-03 |
$15,575,000 |
| 11302643 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba +1 more |
2022-04-12 |
$16,909,000 |
| 10651108 |
Foam composite |
Zhizhong Tang, Syadwad Jain, Wei Hu, Michael A. Schroeder, Rajen S. Sidhu +3 more |
2020-05-12 |
$29,489,000 |
| 10535615 |
Electronic package that includes multi-layer stiffener |
Srikant Nekkanty, Rajendra C. Dias, Patrick Nardi |
2020-01-14 |
$30,813,000 |
| 10206277 |
Gradient encapsulant protection of devices in stretchable electronics |
Rajendra C. Dias, Tatyana N. Andryushchenko, Aleksandar Aleksov, David Staines |
2019-02-12 |
$25,597,000 |
| 9887104 |
Electronic package and method of connecting a first die to a second die to form an electronic package |
Rajendra C. Dias, Patrick Nardi, David Woodhams |
2018-02-06 |
$17,987,000 |
| 9721906 |
Electronic package with corner supports |
Rajendra C. Dias, Baris Bicen, Digvijay A. Raorane, Bharat P. Penmecha |
2017-08-01 |
$11,137,000 |
| 9508660 |
Microelectronic die having chamfered corners |
Emre Armagan, Rajendra C. Dias, Lars D. Skoglund |
2016-11-29 |
$9,403,000 |
| 9431274 |
Method for reducing underfill filler settling in integrated circuit packages |
Suriyakala Ramalingam, Hsin-Yu Li, Michelle S. Phen, Hitesh Arora, Nisha Ananthakrishnan +3 more |
2016-08-30 |
$15,019,000 |
| 9230833 |
Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures |
Rajendra C. Dias, Yonghao Xiu, Arjun Krishnan, Yiqun Bai, Purushotham Kaushik Muthur Srinath |
2016-01-05 |
$11,513,000 |
| 8999765 |
Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures |
Rajendra C. Dias, Yonghao Xiu, Arjun Krishnan, Yiqun Bai, Purushotham Kaushik Muthur Srinath |
2015-04-07 |
$25,687,000 |
