Issued Patents All Time
Showing 25 most recent of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334472 | Multiple wafer stack architecture to enable singulation | Omkar G. Karhade | 2025-06-17 |
| 12243792 | Microelectronic structures including bridges | Omkar G. Karhade, Xiaoxuan Sun, Nitin A. Deshpande | 2025-03-04 |
| 12199085 | Multi-chip packaging | Robert L. Sankman, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2025-01-14 |
| 12176268 | Open cavity bridge co-planar placement architectures and processes | Omkar G. Karhade, Digvijay A. Raorane, Nitin A. Deshpande, Mitul Modi, Manish Dubey +1 more | 2024-12-24 |
| 12170253 | Metal-free frame design for silicon bridges for semiconductor packages | Dae-Woo Kim, Sujit Sharan | 2024-12-17 |
| 12119317 | Singulation of microelectronic components with direct bonding interfaces | Bhaskar Jyoti Krishnatreya, Nagatoshi Tsunoda, Shawna M. Liff | 2024-10-15 |
| 12074121 | Metal-free frame design for silicon bridges for semiconductor packages | Dae-Woo Kim, Sujit Sharan | 2024-08-27 |
| 12027448 | Open cavity bridge power delivery architectures and processes | Omkar G. Karhade, Mitul Modi, Nitin A. Deshpande, Digvijay A. Raorane | 2024-07-02 |
| 11887962 | Microelectronic structures including bridges | Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia, Edvin Cetegen, Anurag Tripathi +6 more | 2024-01-30 |
| 11817444 | Multi-chip packaging | Robert L. Sankman, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2023-11-14 |
| 11804470 | Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control | Xavier Francois Brun, Kaizad Mistry, Paul R. Start, Nisha Ananthakrishnan, Yawei Liang +2 more | 2023-10-31 |
| 11791274 | Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects | Manish Dubey, Omkar G. Karhade, Nitin A. Deshpande, Jinhe Liu, Mohit Bhatia +1 more | 2023-10-17 |
| 11626372 | Metal-free frame design for silicon bridges for semiconductor packages | Dae-Woo Kim, Sujit Sharan | 2023-04-11 |
| 11348911 | Multi-chip packaging | Robert L. Sankman, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2022-05-31 |
| 11114388 | Warpage control for microelectronics packages | Eric J. Li, Guotao Wang, Huiyang Fei, Omkar G. Karhade, Nitin A. Deshpande | 2021-09-07 |
| 10916514 | Metal-free frame design for silicon bridges for semiconductor packages | Dae-Woo Kim, Sujit Sharan | 2021-02-09 |
| 10700051 | Multi-chip packaging | Robert L. Sankman, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2020-06-30 |
| 10607909 | Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging | Purushotham Kaushik Muthur Srinath, Pramod Malatkar, Chandra Mohan Jha, Arnab Choudhury, Nachiket R. Raravikar | 2020-03-31 |
| 10461047 | Metal-free frame design for silicon bridges for semiconductor packages | Dae-Woo Kim, Sujit Sharan | 2019-10-29 |
| 10256198 | Warpage control for microelectronics packages | Eric J. Li, Guotao Wang, Huiyang Fei, Omkar G. Karhade, Nitin A. Deshpande | 2019-04-09 |
| 10128225 | Interconnect structures with polymer core | Sandeep Razdan, Edward R. Prack, Robert L. Sankman, Shan Zhong, Robert M. Nickerson | 2018-11-13 |
| 10090259 | Non-rectangular electronic device components | Pramod Malatkar, Shawna M. Liff | 2018-10-02 |
| 9613934 | Interconnect structures with polymer core | Sandeep Razdan, Edward R. Prack, Robert L. Sankman, Shan Zhong, Robert M. Nickerson | 2017-04-04 |
| 9603247 | Electronic package with narrow-factor via including finish layer | Rajasekaran Swaminathan, Amruthavalli Pallavi Alur, Ram Viswanath, Wei-Lun Kane Jen | 2017-03-21 |
| 9526285 | Flexible computing fabric | Aleksandar Aleksov, Ravindranath V. Mahajan, Ian A. Young, John C. Johnson, Debendra Mallik +1 more | 2016-12-27 |