| 12243806 |
Nested architectures for enhanced heterogeneous integration |
Ravindranath V. Mahajan, Debendra Mallik, Sujit Sharan |
2025-03-04 |
|
| 12183649 |
IC package including multi-chip unit with bonded integrated heat spreader |
Debendra Mallik, Ravindranath V. Mahajan |
2024-12-31 |
$16,542,000 |
| 12176268 |
Open cavity bridge co-planar placement architectures and processes |
Omkar G. Karhade, Sairam Agraharam, Nitin A. Deshpande, Mitul Modi, Manish Dubey +1 more |
2024-12-24 |
$17,261,000 |
| 12159813 |
Embedded bridge die with through-silicon vias |
Aditya S. Vaidya, Ravindranath V. Mahajan, Paul R. Start |
2024-12-03 |
$28,395,000 |
| 12142545 |
Nested architectures for enhanced heterogeneous integration |
Ravindranath V. Mahajan, Debendra Mallik, Sujit Sharan |
2024-11-12 |
$28,491,000 |
| 12068222 |
Dummy die structures of a packaged integrated circuit device |
Mitul Modi, Joseph Van Nausdle, Omkar G. Karhade, Edvin Cetegen, Nicholas S. Haehn +4 more |
2024-08-20 |
$20,163,000 |
| 12027448 |
Open cavity bridge power delivery architectures and processes |
Omkar G. Karhade, Mitul Modi, Sairam Agraharam, Nitin A. Deshpande |
2024-07-02 |
$27,114,000 |
| 12009318 |
Control of warpage using ABF GC cavity for embedded die package |
Ian En Yoon Chin, Daniel N. Sobieski |
2024-06-11 |
$21,221,000 |
| 11978948 |
Die with embedded communication cavity |
Vijay K. Nair |
2024-05-07 |
$26,756,000 |
| 11798865 |
Nested architectures for enhanced heterogeneous integration |
Ravindranath V. Mahajan, Debendra Mallik, Sujit Sharan |
2023-10-24 |
$20,059,000 |
| 11749577 |
IC package including multi-chip unit with bonded integrated heat spreader |
Debendra Mallik, Ravindranath V. Mahajan |
2023-09-05 |
$19,899,000 |
| 11742261 |
Nested architectures for enhanced heterogeneous integration |
Ravindranath V. Mahajan, Debendra Mallik, Sujit Sharan |
2023-08-29 |
$19,273,000 |
| 11742270 |
Landing pad apparatus for through-silicon-vias |
— |
2023-08-29 |
$19,273,000 |
| 11594493 |
Ceramic interposers for on-die interconnects |
— |
2023-02-28 |
$10,430,000 |
| 11587851 |
Embedded bridge with through-silicon vias |
Aditya S. Vaidya, Ravindranath V. Mahajan, Paul R. Start |
2023-02-21 |
$13,703,000 |
| 11581235 |
IC package including multi-chip unit with bonded integrated heat spreader |
Debendra Mallik, Ravindranath V. Mahajan |
2023-02-14 |
$12,790,000 |
| 11569173 |
Bridge hub tiling architecture |
Andrew Collins, Wilfred Gomes, Ravindranath V. Mahajan, Sujit Sharan |
2023-01-31 |
$11,941,000 |
| 11527489 |
Apparatus and system with package stiffening magnetic inductor core and methods of making the same |
Michael J. Hill, Mathew J. Manusharow, Beomseok Choi |
2022-12-13 |
$11,573,000 |
| 11488880 |
Enclosure for an electronic component |
Vijay K. Nair |
2022-11-01 |
$18,130,000 |
| 11417630 |
Semiconductor package having passive support wafer |
Debendra Mallik, Ravindranath V. Mahajan, Mitul Modi |
2022-08-16 |
$17,788,000 |
| 11322457 |
Control of warpage using ABF GC cavity for embedded die package |
Ian En Yoon Chin, Daniel N. Sobieski |
2022-05-03 |
$16,346,000 |
| 11239186 |
Die with embedded communication cavity |
Vijay K. Nair |
2022-02-01 |
$16,992,000 |
| 11195806 |
High frequency waveguide structure |
Vijay K. Nair |
2021-12-07 |
$28,128,000 |
| 11189573 |
Semiconductor package with electromagnetic interference shielding using metal layers and vias |
Vijay K. Nair |
2021-11-30 |
$30,212,000 |
| 11145583 |
Method to achieve variable dielectric thickness in packages for better electrical performance |
Yidnekachew S. Mekonnen |
2021-10-12 |
$32,982,000 |
