| 12009318 |
Control of warpage using ABF GC cavity for embedded die package |
Digvijay A. Raorane, Ian En Yoon Chin |
2024-06-11 |
$21,221,000 |
| 11322457 |
Control of warpage using ABF GC cavity for embedded die package |
Digvijay A. Raorane, Ian En Yoon Chin |
2022-05-03 |
$16,346,000 |
| 10885253 |
System and method for determining dimensional range of repairable defects by deposition and etching in a virtual fabrication environment |
Rich Wise, Yang Pan, David M. Fried, Jiangjiang Gu |
2021-01-05 |
|
| 10692847 |
Inorganic interposer for multi-chip packaging |
Kristof Darmawikarta, Sri Ranga Sai Boyapati, Merve Celikkol, Kyu Oh Lee, Kemal Aygun +1 more |
2020-06-23 |
$27,746,000 |
| 10658307 |
Control of warpage using ABF GC cavity for embedded die package |
Digvijay A. Rorane, Ian En Yoon Chin |
2020-05-19 |
$31,576,000 |
| 10494700 |
Method of fabricating a microelectronic substrate |
Robert Alan May, Sri Ranga Sai Boyapati, Amruthavalli Pallavi Alur |
2019-12-03 |
$19,496,000 |
| 10375832 |
Method of forming an interference shield on a substrate |
Digvijay A. Raorane, Kemal Aygun, Drew W. Delaney |
2019-08-06 |
$15,127,000 |
| 10103037 |
Flexible microelectronic systems and methods of fabricating the same |
Aleksandar Aleksov, Dilan Seneviratne, Charavana K. Gurumurthy, Ching-Ping Janet Shen |
2018-10-16 |
$21,459,000 |
| 10070537 |
Formation of dielectric with smooth surface |
Deepak Arora, Dilan Seneviratne, Ebrahim Andideh, James C. Meyer |
2018-09-04 |
$19,235,000 |
| 10026691 |
Package substrate having noncircular interconnects |
Kristof Darmawikarta, Kyu Oh Lee |
2018-07-17 |
$22,904,000 |
| 9941219 |
Control of warpage using ABF GC cavity for embedded die package |
Digvijay A. Rorane, Ian En Yoon Chin |
2018-04-10 |
$20,820,000 |
| 9941054 |
Integration of embedded thin film capacitors in package substrates |
Robert L. Sankman, Sri Ranga Sai Boyapati |
2018-04-10 |
$20,820,000 |
| 9899311 |
Hybrid pitch package with ultra high density interconnect capability |
Mathew J. Manusharow, Mihir K. Roy, William J. Lambert |
2018-02-20 |
$17,556,000 |
| 9758845 |
Microelectronic substrates having copper alloy conductive route structures |
Robert Alan May, Sri Ranga Sai Boyapati, Amruthavalli Pallavi Alur |
2017-09-12 |
$10,213,000 |
| 9633938 |
Hybrid pitch package with ultra high density interconnect capability |
Mathew J. Manusharow, Mihir K. Roy, William J. Lambert |
2017-04-25 |
$8,972,000 |
| 9520350 |
Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer |
Weng Hong Teh, Emile Davies-Venn, Ebrahim Andideh, Digvijay A. Raorane |
2016-12-13 |
$15,488,000 |
| 9505610 |
Device, system and method for providing MEMS structures of a semiconductor package |
Weng Hong Teh, Tarek A. Ibrahim, Sarah Haney, Parshuram Balkrishna Zantye, Chad Eric Mair +1 more |
2016-11-29 |
$9,403,000 |
| 9420693 |
Integration of embedded thin film capacitors in package substrates |
Robert L. Sankman, Sri Ranga Sai Boyapati |
2016-08-16 |
$10,311,000 |
| 9232686 |
Thin film based electromagnetic interference shielding with BBUL/coreless packages |
Digvijay A. Raorane, Kemal Aygun, Drew W. Delaney |
2016-01-05 |
$11,513,000 |
