Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009318 | Control of warpage using ABF GC cavity for embedded die package | Digvijay A. Raorane, Ian En Yoon Chin | 2024-06-11 |
| 11322457 | Control of warpage using ABF GC cavity for embedded die package | Digvijay A. Raorane, Ian En Yoon Chin | 2022-05-03 |
| 10885253 | System and method for determining dimensional range of repairable defects by deposition and etching in a virtual fabrication environment | Rich Wise, Yang Pan, David M. Fried, Jiangjiang Gu | 2021-01-05 |
| 10692847 | Inorganic interposer for multi-chip packaging | Kristof Darmawikarta, Sri Ranga Sai Boyapati, Merve Celikkol, Kyu Oh Lee, Kemal Aygun +1 more | 2020-06-23 |
| 10658307 | Control of warpage using ABF GC cavity for embedded die package | Digvijay A. Rorane, Ian En Yoon Chin | 2020-05-19 |
| 10494700 | Method of fabricating a microelectronic substrate | Robert Alan May, Sri Ranga Sai Boyapati, Amruthavalli Pallavi Alur | 2019-12-03 |
| 10375832 | Method of forming an interference shield on a substrate | Digvijay A. Raorane, Kemal Aygun, Drew W. Delaney | 2019-08-06 |
| 10103037 | Flexible microelectronic systems and methods of fabricating the same | Aleksandar Aleksov, Dilan Seneviratne, Charavana K. Gurumurthy, Ching-Ping Janet Shen | 2018-10-16 |
| 10070537 | Formation of dielectric with smooth surface | Deepak Arora, Dilan Seneviratne, Ebrahim Andideh, James C. Meyer | 2018-09-04 |
| 10026691 | Package substrate having noncircular interconnects | Kristof Darmawikarta, Kyu Oh Lee | 2018-07-17 |
| 9941219 | Control of warpage using ABF GC cavity for embedded die package | Digvijay A. Rorane, Ian En Yoon Chin | 2018-04-10 |
| 9941054 | Integration of embedded thin film capacitors in package substrates | Robert L. Sankman, Sri Ranga Sai Boyapati | 2018-04-10 |
| 9899311 | Hybrid pitch package with ultra high density interconnect capability | Mathew J. Manusharow, Mihir K. Roy, William J. Lambert | 2018-02-20 |
| 9758845 | Microelectronic substrates having copper alloy conductive route structures | Robert Alan May, Sri Ranga Sai Boyapati, Amruthavalli Pallavi Alur | 2017-09-12 |
| 9633938 | Hybrid pitch package with ultra high density interconnect capability | Mathew J. Manusharow, Mihir K. Roy, William J. Lambert | 2017-04-25 |
| 9520350 | Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer | Weng Hong Teh, Emile Davies-Venn, Ebrahim Andideh, Digvijay A. Raorane | 2016-12-13 |
| 9505610 | Device, system and method for providing MEMS structures of a semiconductor package | Weng Hong Teh, Tarek A. Ibrahim, Sarah Haney, Parshuram Balkrishna Zantye, Chad Eric Mair +1 more | 2016-11-29 |
| 9420693 | Integration of embedded thin film capacitors in package substrates | Robert L. Sankman, Sri Ranga Sai Boyapati | 2016-08-16 |
| 9232686 | Thin film based electromagnetic interference shielding with BBUL/coreless packages | Digvijay A. Raorane, Kemal Aygun, Drew W. Delaney | 2016-01-05 |