| 12113032 |
Substrate having undercut portion for stress mitigation |
YongIk Choi, Chris Y. Chung, Michael Leary, Domingo Figueredo, Chang Kyu Choi +1 more |
2024-10-08 |
|
| 11723143 |
Thermal dissipation and shielding improvement using merged PCB bottom copper post |
Chang Kyu Choi, Hyun Mo Ku, Li Sun |
2023-08-08 |
|
| 11276650 |
Stress mitigation structure |
YongIk Choi, Chris Y. Chung, Michael Leary, Domingo Figueredo, Chang Kyu Choi +1 more |
2022-03-15 |
|
| 10827617 |
Printed circuit board with cavity |
Dingyou Zhang, Nitesh Kumbhat, Li Sun, Chang Kyu Choi |
2020-11-03 |
|
| 10271421 |
Systems and methods for providing electromagnetic interference (EMI) shielding between inductors of a radio frequency (RF) module |
Bernhard Gebauer, Oliver Wiedenmann, Lueder Elbrecht, Deog Soon Choi, Aaron Lee |
2019-04-23 |
|
| 10179729 |
Hermetic encapsulation for microelectromechanical systems (MEMS) devices |
Weng Hong Teh, Feras Eid, Sasha N. Oster |
2019-01-15 |
$38,709,000 |
| 10068834 |
Floating bond pad for power semiconductor devices |
Brett Hull, Daniel Namishia |
2018-09-04 |
$19,064,000 |
| 10033093 |
mmWave antennas and transmission lines on standard substrate materials |
Adel A. Elsherbini, Telesphor Kamgaing |
2018-07-24 |
$23,531,000 |
| 9997428 |
Via structures for thermal dissipation |
Marshall Maple, Ashish Alawani, Li Sun |
2018-06-12 |
$165,801,000 |
| 9974181 |
Module with external shield and back-spill barrier for protecting contact pads |
Deog Soon Choi, Hyun Mo Ku, Lea-Teng Lee, Nitesh Kumbhat, Ah Ron Lee |
2018-05-15 |
$86,872,000 |
| 9791470 |
Magnet placement for integrated sensor packages |
Feras Eid, Sasha N. Oster, Kyu Oh Lee |
2017-10-17 |
$9,876,000 |
| 9505610 |
Device, system and method for providing MEMS structures of a semiconductor package |
Weng Hong Teh, Tarek A. Ibrahim, Daniel N. Sobieski, Parshuram Balkrishna Zantye, Chad Eric Mair +1 more |
2016-11-29 |
$9,403,000 |
| 9501068 |
Integration of pressure sensors into integrated circuit fabrication and packaging |
Kyu Oh Lee, Sasha N. Oster, Feras Eid |
2016-11-22 |
$9,157,000 |
| 9345184 |
Magnetic field shielding for packaging build-up architectures |
Sasha N. Oster, Weng Hong Teh, Feras Eid |
2016-05-17 |
$8,600,000 |
| 9312256 |
Bidirectional silicon carbide transient voltage supression devices |
Sei-Hyung Ryu |
2016-04-12 |
$2,814,000 |
| 9260294 |
Integration of pressure or inertial sensors into integrated circuit fabrication and packaging |
Kyu Oh Lee, Sasha N. Oster, Feras Eid |
2016-02-16 |
$10,295,000 |
| 9242854 |
Hermetic encapsulation for microelectromechanical systems (MEMS) devices |
Weng Hong Teh, Feras Eid, Sasha N. Oster |
2016-01-26 |
$9,792,000 |
| 8445917 |
Bidirectional silicon carbide transient voltage suppression devices |
Sei-Hyung Ryu |
2013-05-21 |
$17,267,000 |
| 7795691 |
Semiconductor transistor with P type re-grown channel layer |
Qingchun Zhang, Anant Agarwal |
2010-09-14 |
$11,097,000 |
