Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113032 | Substrate having undercut portion for stress mitigation | YongIk Choi, Chris Y. Chung, Michael Leary, Domingo Figueredo, Chang Kyu Choi +1 more | 2024-10-08 |
| 11723143 | Thermal dissipation and shielding improvement using merged PCB bottom copper post | Chang Kyu Choi, Hyun Mo Ku, Li Sun | 2023-08-08 |
| 11276650 | Stress mitigation structure | YongIk Choi, Chris Y. Chung, Michael Leary, Domingo Figueredo, Chang Kyu Choi +1 more | 2022-03-15 |
| 10827617 | Printed circuit board with cavity | Dingyou Zhang, Nitesh Kumbhat, Li Sun, Chang Kyu Choi | 2020-11-03 |
| 10271421 | Systems and methods for providing electromagnetic interference (EMI) shielding between inductors of a radio frequency (RF) module | Bernhard Gebauer, Oliver Wiedenmann, Lueder Elbrecht, Deog Soon Choi, Aaron Lee | 2019-04-23 |
| 10179729 | Hermetic encapsulation for microelectromechanical systems (MEMS) devices | Weng Hong Teh, Feras Eid, Sasha N. Oster | 2019-01-15 |
| 10068834 | Floating bond pad for power semiconductor devices | Brett Hull, Daniel Namishia | 2018-09-04 |
| 10033093 | mmWave antennas and transmission lines on standard substrate materials | Adel A. Elsherbini, Telesphor Kamgaing | 2018-07-24 |
| 9997428 | Via structures for thermal dissipation | Marshall Maple, Ashish Alawani, Li Sun | 2018-06-12 |
| 9974181 | Module with external shield and back-spill barrier for protecting contact pads | Deog Soon Choi, Hyun Mo Ku, Lea-Teng Lee, Nitesh Kumbhat, Ah Ron Lee | 2018-05-15 |
| 9791470 | Magnet placement for integrated sensor packages | Feras Eid, Sasha N. Oster, Kyu Oh Lee | 2017-10-17 |
| 9505610 | Device, system and method for providing MEMS structures of a semiconductor package | Weng Hong Teh, Tarek A. Ibrahim, Daniel N. Sobieski, Parshuram Balkrishna Zantye, Chad Eric Mair +1 more | 2016-11-29 |
| 9501068 | Integration of pressure sensors into integrated circuit fabrication and packaging | Kyu Oh Lee, Sasha N. Oster, Feras Eid | 2016-11-22 |
| 9345184 | Magnetic field shielding for packaging build-up architectures | Sasha N. Oster, Weng Hong Teh, Feras Eid | 2016-05-17 |
| 9312256 | Bidirectional silicon carbide transient voltage supression devices | Sei-Hyung Ryu | 2016-04-12 |
| 9260294 | Integration of pressure or inertial sensors into integrated circuit fabrication and packaging | Kyu Oh Lee, Sasha N. Oster, Feras Eid | 2016-02-16 |
| 9242854 | Hermetic encapsulation for microelectromechanical systems (MEMS) devices | Weng Hong Teh, Feras Eid, Sasha N. Oster | 2016-01-26 |
| 8445917 | Bidirectional silicon carbide transient voltage suppression devices | Sei-Hyung Ryu | 2013-05-21 |
| 7795691 | Semiconductor transistor with P type re-grown channel layer | Qingchun Zhang, Anant Agarwal | 2010-09-14 |