| 11842937 |
Encapsulation stack for improved humidity performance and related fabrication methods |
Chris Hardiman, Kyle Bothe, Elizabeth Keenan |
2023-12-12 |
| 11842997 |
Methods for pillar connection on frontside and passive device integration on backside of die |
Terry Alcorn, Fabian Radulescu |
2023-12-12 |
| 11769768 |
Methods for pillar connection on frontside and passive device integration on backside of die |
Terry Alcorn, Fabian Radulescu |
2023-09-26 |
| 11587842 |
Semiconductor die with improved ruggedness |
Chris Hardiman, Kyoung-Keun Lee, Fabian Radulescu, Scott Sheppard |
2023-02-21 |
| 10886189 |
Semiconductor die with improved ruggedness |
Chris Hardiman, Kyoung-Keun Lee, Fabian Radulescu, Scott Sheppard |
2021-01-05 |
| 10332817 |
Semiconductor die with improved ruggedness |
Chris Hardiman, Kyoung-Keun Lee, Fabian Radulescu, Scott Sheppard |
2019-06-25 |
| 10068834 |
Floating bond pad for power semiconductor devices |
Sarah Haney, Brett Hull |
2018-09-04 |
| 9934983 |
Stress mitigation for thin and thick films used in semiconductor circuitry |
Zoltan Ring, Donald A. Gajewski, Scott Sheppard |
2018-04-03 |
| 9812338 |
Encapsulation of advanced devices using novel PECVD and ALD schemes |
Zoltan Ring, Helmut Hagleitner |
2017-11-07 |
| 9761439 |
PECVD protective layers for semiconductor devices |
Zoltan Ring, Sei-Hyung Ryu |
2017-09-12 |
| 9269662 |
Using stress reduction barrier sub-layers in a semiconductor die |
Zoltan Ring, Helmut Hagleitner, Fabian Radulescu |
2016-02-23 |
| 9214352 |
Ohmic contact to semiconductor device |
Helmut Hagleitner |
2015-12-15 |
| 9202703 |
Ni-rich Schottky contact |
Helmut Hagleitner, Fabian Radulescu |
2015-12-01 |
| 8877611 |
Devices with crack stops |
Van Mieczkowski |
2014-11-04 |
| 8357996 |
Devices with crack stops |
Van Mieczkowski |
2013-01-22 |