Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842937 | Encapsulation stack for improved humidity performance and related fabrication methods | Chris Hardiman, Kyle Bothe, Elizabeth Keenan | 2023-12-12 |
| 11842997 | Methods for pillar connection on frontside and passive device integration on backside of die | Terry Alcorn, Fabian Radulescu | 2023-12-12 |
| 11769768 | Methods for pillar connection on frontside and passive device integration on backside of die | Terry Alcorn, Fabian Radulescu | 2023-09-26 |
| 11587842 | Semiconductor die with improved ruggedness | Chris Hardiman, Kyoung-Keun Lee, Fabian Radulescu, Scott Sheppard | 2023-02-21 |
| 10886189 | Semiconductor die with improved ruggedness | Chris Hardiman, Kyoung-Keun Lee, Fabian Radulescu, Scott Sheppard | 2021-01-05 |
| 10332817 | Semiconductor die with improved ruggedness | Chris Hardiman, Kyoung-Keun Lee, Fabian Radulescu, Scott Sheppard | 2019-06-25 |
| 10068834 | Floating bond pad for power semiconductor devices | Sarah Haney, Brett Hull | 2018-09-04 |
| 9934983 | Stress mitigation for thin and thick films used in semiconductor circuitry | Zoltan Ring, Donald A. Gajewski, Scott Sheppard | 2018-04-03 |
| 9812338 | Encapsulation of advanced devices using novel PECVD and ALD schemes | Zoltan Ring, Helmut Hagleitner | 2017-11-07 |
| 9761439 | PECVD protective layers for semiconductor devices | Zoltan Ring, Sei-Hyung Ryu | 2017-09-12 |
| 9269662 | Using stress reduction barrier sub-layers in a semiconductor die | Zoltan Ring, Helmut Hagleitner, Fabian Radulescu | 2016-02-23 |
| 9214352 | Ohmic contact to semiconductor device | Helmut Hagleitner | 2015-12-15 |
| 9202703 | Ni-rich Schottky contact | Helmut Hagleitner, Fabian Radulescu | 2015-12-01 |
| 8877611 | Devices with crack stops | Van Mieczkowski | 2014-11-04 |
| 8357996 | Devices with crack stops | Van Mieczkowski | 2013-01-22 |