Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842997 | Methods for pillar connection on frontside and passive device integration on backside of die | Daniel Namishia, Fabian Radulescu | 2023-12-12 |
| 11769768 | Methods for pillar connection on frontside and passive device integration on backside of die | Daniel Namishia, Fabian Radulescu | 2023-09-26 |
| 11658234 | Field effect transistor with enhanced reliability | Kyle Bothe, Dan Namishia, Jia Guo, Matt King, Saptharishi Sriram +4 more | 2023-05-23 |
| 11616136 | High electron mobility transistors and power amplifiers including said transistors having improved performance and reliability | Kyle Bothe, Evan Jones, Dan Namishia, Chris Hardiman, Fabian Radulescu +2 more | 2023-03-28 |
| 11502178 | Field effect transistor with at least partially recessed field plate | Kyle Bothe, Jia Guo, Fabian Radulescu, Scott Sheppard | 2022-11-15 |
| 11075271 | Stepped field plates with proximity to conduction channel and related fabrication methods | Evan Jones, Jia Guo, Fabian Radulescu, Scott Sheppard | 2021-07-27 |
| 10971612 | High electron mobility transistors and power amplifiers including said transistors having improved performance and reliability | Kyle Bothe, Evan Jones, Dan Namishia, Chris Hardiman, Fabian Radulescu +2 more | 2021-04-06 |
| 9847411 | Recessed field plate transistor structures | Saptharishi Sriram, Fabian Radulescu, Scott Sheppard | 2017-12-19 |
| 9679981 | Cascode structures for GaN HEMTs | Saptharishi Sriram, Fabian Radulescu, Scott Sheppard | 2017-06-13 |
| 9536783 | Wafer-level die attach metallization | Fabian Radulescu, Helmut Hagleitner, William T. Pulz, Van Mieczkowski | 2017-01-03 |
| 8970010 | Wafer-level die attach metallization | Fabian Radulescu, Helmut Hagleitner, William T. Pulz | 2015-03-03 |