Issued Patents All Time
Showing 25 most recent of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12382699 | Plasma-based barrier layer removal method for increasing peak transconductance while maintaining on-state resistance and related devices | Chris Hardiman, Kyoung-Keun Lee, Kyle Bothe | 2025-08-05 |
| 11887945 | Semiconductor device with isolation and/or protection structures | Lei Zhao | 2024-01-30 |
| 11869964 | Field effect transistors with modified access regions | Kyoung-Keun Lee, Scott Sheppard | 2024-01-09 |
| 11842997 | Methods for pillar connection on frontside and passive device integration on backside of die | Terry Alcorn, Daniel Namishia | 2023-12-12 |
| 11769768 | Methods for pillar connection on frontside and passive device integration on backside of die | Terry Alcorn, Daniel Namishia | 2023-09-26 |
| 11735538 | Semiconductor having a backside wafer cavity for radio frequency (RF) passive device integration and/or improved cooling and process of implementing the same | — | 2023-08-22 |
| 11682634 | Packaged electronic circuits having moisture protection encapsulation and methods of forming same | Kyle Bothe, Dan Namishia, Scott Sheppard | 2023-06-20 |
| 11658234 | Field effect transistor with enhanced reliability | Kyle Bothe, Terry Alcorn, Dan Namishia, Jia Guo, Matt King +4 more | 2023-05-23 |
| 11621322 | Die-to-die isolation structures for packaged transistor devices | Lei Zhao | 2023-04-04 |
| 11616136 | High electron mobility transistors and power amplifiers including said transistors having improved performance and reliability | Kyle Bothe, Evan Jones, Dan Namishia, Chris Hardiman, Terry Alcorn +2 more | 2023-03-28 |
| 11587842 | Semiconductor die with improved ruggedness | Chris Hardiman, Kyoung-Keun Lee, Daniel Namishia, Scott Sheppard | 2023-02-21 |
| 11533025 | Integrated doherty amplifier with added isolation between the carrier and the peaking transistors | Lei Zhao | 2022-12-20 |
| 11502178 | Field effect transistor with at least partially recessed field plate | Kyle Bothe, Jia Guo, Terry Alcorn, Scott Sheppard | 2022-11-15 |
| 11355600 | High electron mobility transistors having improved drain current drift and/or leakage current performance | Kyoung-Keun Lee, Scott Sheppard | 2022-06-07 |
| 11075271 | Stepped field plates with proximity to conduction channel and related fabrication methods | Evan Jones, Terry Alcorn, Jia Guo, Scott Sheppard | 2021-07-27 |
| 10971612 | High electron mobility transistors and power amplifiers including said transistors having improved performance and reliability | Kyle Bothe, Evan Jones, Dan Namishia, Chris Hardiman, Terry Alcorn +2 more | 2021-04-06 |
| 10937873 | High electron mobility transistors having improved drain current drift and/or leakage current performance | Kyoung-Keun Lee, Scott Sheppard | 2021-03-02 |
| 10923585 | High electron mobility transistors having improved contact spacing and/or improved contact vias | Kyle Bothe, Evan Jones, Dan Namishia, Chris Hardiman, Jeremy Fisher +1 more | 2021-02-16 |
| 10886189 | Semiconductor die with improved ruggedness | Chris Hardiman, Kyoung-Keun Lee, Daniel Namishia, Scott Sheppard | 2021-01-05 |
| 10811370 | Packaged electronic circuits having moisture protection encapsulation and methods of forming same | Kyle Bothe, Dan Namishia, Scott Sheppard | 2020-10-20 |
| 10332817 | Semiconductor die with improved ruggedness | Chris Hardiman, Kyoung-Keun Lee, Daniel Namishia, Scott Sheppard | 2019-06-25 |
| 9847411 | Recessed field plate transistor structures | Saptharishi Sriram, Terry Alcorn, Scott Sheppard | 2017-12-19 |
| 9679981 | Cascode structures for GaN HEMTs | Saptharishi Sriram, Terry Alcorn, Scott Sheppard | 2017-06-13 |
| 9608078 | Semiconductor device with improved field plate | Helmut Hagleitner, Saptharishi Sriram, Daniel Etter | 2017-03-28 |
| 9536783 | Wafer-level die attach metallization | Helmut Hagleitner, Terry Alcorn, William T. Pulz, Van Mieczkowski | 2017-01-03 |