Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10020244 | Polymer via plugs with high thermal integrity | Van Mieczkowski, Helmut Hagleitner | 2018-07-10 |
| 9536783 | Wafer-level die attach metallization | Fabian Radulescu, Helmut Hagleitner, Terry Alcorn, Van Mieczkowski | 2017-01-03 |
| 8970010 | Wafer-level die attach metallization | Fabian Radulescu, Helmut Hagleitner, Terry Alcorn | 2015-03-03 |