| RE49167 |
Passivation structure for semiconductor devices |
Jonathan D. Young, Qingchun Zhang, John Williams Palmour |
2022-08-09 |
|
| 10707858 |
Power module with improved reliability |
Mrinal K. Das, Adam Barkley, Brian Fetzer, Jonathan D. Young, Scott Allen |
2020-07-07 |
$84,287,000 |
| 10020244 |
Polymer via plugs with high thermal integrity |
Helmut Hagleitner, William T. Pulz |
2018-07-10 |
$12,952,000 |
| 9998109 |
Power module with improved reliability |
Mrinal K. Das, Adam Barkley, Brian Fetzer, Jonathan D. Young, Scott Allen |
2018-06-12 |
$13,660,000 |
| 9991399 |
Passivation structure for semiconductor devices |
Jonathan D. Young, Qingchun Zhang, John Williams Palmour |
2018-06-05 |
$20,713,000 |
| 9607955 |
Contact pad |
Zoltan Ring, Jason Gurganus, Helmut Hagleitner |
2017-03-28 |
$1,748,000 |
| 9536783 |
Wafer-level die attach metallization |
Fabian Radulescu, Helmut Hagleitner, Terry Alcorn, William T. Pulz |
2017-01-03 |
$2,515,000 |
| 9343383 |
High voltage semiconductor devices including electric arc suppression material and methods of forming the same |
— |
2016-05-17 |
$3,004,000 |
| 9142631 |
Multilayer diffusion barriers for wide bandgap Schottky barrier devices |
Helmut Hagleitner, Zoltan Ring |
2015-09-22 |
$2,694,000 |
| 8907350 |
Semiconductor devices having improved adhesion and methods of fabricating the same |
Helmut Hagleitner |
2014-12-09 |
$8,413,000 |
| 8896122 |
Semiconductor devices having gates including oxidized nickel |
Helmut Hagleitner, Kevin Haberern |
2014-11-25 |
$5,647,000 |
| 8877611 |
Devices with crack stops |
Daniel Namishia |
2014-11-04 |
$3,190,000 |
| 8810355 |
Thin film resistor |
Jason Gurganus |
2014-08-19 |
$9,758,000 |
| 8669563 |
Light emitting devices having roughened/reflective contacts and methods of fabricating same |
Kevin Haberern, Michael John Bergmann, David T. Emerson |
2014-03-11 |
$15,325,000 |
| 8570140 |
Thin film resistor |
Jason Gurganus |
2013-10-29 |
$29,103,000 |
| 8471269 |
Light emitting devices having roughened/reflective contacts and methods of fabricating same |
Kevin Haberern, Michael John Bergmann, David T. Emerson |
2013-06-25 |
$68,181,000 |
| 8357996 |
Devices with crack stops |
Daniel Namishia |
2013-01-22 |
$15,281,000 |
| 7557380 |
Light emitting devices having a reflective bond pad and methods of fabricating light emitting devices having reflective bond pads |
Kevin Haberern, Michael John Bergmann, David T. Emerson |
2009-07-07 |
$15,515,000 |
| 7557379 |
Light emitting devices having a roughened reflective bond pad and methods of fabricating light emitting devices having roughened reflective bond pads |
Kevin Haberern, Michael John Bergmann, David T. Emerson |
2009-07-07 |
$15,515,000 |
| 7473938 |
Robust Group III light emitting diode for high reliability in standard packaging applications |
John Edmond, Brian Thibeault, David B. Slater, Jr., Gerald H. Negley |
2009-01-06 |
$21,425,000 |
| 7125737 |
Robust Group III light emitting diode for high reliability in standard packaging applications |
John Edmond, Brian Thibeault, David B. Slater, Jr., Gerald H. Negley |
2006-10-24 |
$4,795,000 |
| 6825501 |
Robust Group III light emitting diode for high reliability in standard packaging applications |
John Edmond, Brian Thibeault, David B. Slater, Jr., Gerald H. Negley |
2004-11-30 |
$10,343,000 |