Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046998 | High speed, efficient SiC power module | Mrinal K. Das, Henry Lin, Marcelo Schupbach | 2024-07-23 |
| 12002720 | Methods and systems for component analysis, sorting, and sequencing based on component parameters and devices utilizing the methods and systems | Zach Cole, Morgan Andrew Roddy, John R. Fraley, Jonathan K. HAYES | 2024-06-04 |
| 11888392 | High speed, efficient sic power module | Mrinal K. Das, Henry Lin, Marcelo Schupbach | 2024-01-30 |
| 11184001 | Power switching devices with high dV/dt capability and methods of making such devices | Qingchun Zhang, Sei-Hyung Ryu, Brett Hull | 2021-11-23 |
| 11057033 | Hybrid power module | Edward Robert Van Brunt, Sei-Hyung Ryu, Zachary Cole, Kraig J. Olejniczak | 2021-07-06 |
| 10707858 | Power module with improved reliability | Mrinal K. Das, Brian Fetzer, Jonathan D. Young, Van Mieczkowski, Scott Allen | 2020-07-07 |
| 10680518 | High speed, efficient SiC power module | Mrinal K. Das, Henry Lin, Marcelo Schupbach | 2020-06-09 |
| 10601413 | Power switching devices with DV/DT capability and methods of making such devices | Qingchun Zhang, Sei-Hyung Ryu, Brett Hull | 2020-03-24 |
| 10269955 | Vertical FET structure | Sei-Hyung Ryu, Marcelo Schupbach, Scott Allen | 2019-04-23 |
| 10224810 | High speed, efficient SiC power module | Marcelo Schupbach | 2019-03-05 |
| 9998109 | Power module with improved reliability | Mrinal K. Das, Brian Fetzer, Jonathan D. Young, Van Mieczkowski, Scott Allen | 2018-06-12 |
| 9906137 | High power density, high efficiency power electronic converter | Xuechao Liu, Marcelo Schupbach | 2018-02-27 |
| 9647563 | Active energy recovery clamping circuit to improve the performance of power converters | Bret Whitaker | 2017-05-09 |
| 9407251 | Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration | Brandon Passmore, Zach Cole, Bret Whitaker, Ty R. McNutt, Alexander Lostetter | 2016-08-02 |
| 9275938 | Low profile high temperature double sided flip chip power packaging | Brice McPherson, Brandon Passmore, Robert Shaw | 2016-03-01 |