Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1073632 | Power module | Brice McPherson, Roberto M. Schupbach, Jennifer Stabach-Smith | 2025-05-06 |
| 12080635 | Power module | Brice McPherson, Roberto M. Schupbach, Jennifer Stabach-Smith | 2024-09-03 |
| 11984433 | Arrangements of power semiconductor devices for improved thermal performance | Brice McPherson, Benjamin A. Samples | 2024-05-14 |
| 11721617 | Power module | Brice McPherson, Roberto M. Schupbach, Jennifer Stabach-Smith | 2023-08-08 |
| 11206740 | High voltage power module | Zachary Cole | 2021-12-21 |
| D909310 | Power module | Brice McPherson, Sayan Seal, Zachary Cole, Jennifer Stabach, Ty R. McNutt +1 more | 2021-02-02 |
| D908632 | Power module | Zachary Cole | 2021-01-26 |
| 10784235 | Silicon carbide power module | Brice McPherson, Sayan Seal, Zachary Cole, Jennifer Stabach, Ty R. McNutt +1 more | 2020-09-22 |
| 10750627 | High voltage power module | Zachary Cole | 2020-08-18 |
| 10448524 | High voltage power module | Zachary Cole | 2019-10-15 |
| 10136529 | Low profile, highly configurable, current sharing paralleled wide band gap power device power module | Brice McPherson, Peter Killeen, Alex Lostetter, Robert Shaw, Jared Hornberger +1 more | 2018-11-20 |
| 10080301 | High voltage power chip module | Zachary Cole, Brice McPherson | 2018-09-18 |
| 9839146 | High voltage power module | Zachary Cole | 2017-12-05 |
| 9761506 | Semiconductor device and fabrication method for the same | Takukazu Otsuka, Bryon Western, Zach Cole | 2017-09-12 |
| 9705311 | Mid-infrared tunable metamaterials | Igal Brener, Xiaoyu Miao, Eric A. Shaner | 2017-07-11 |
| 9426883 | Low profile, highly configurable, current sharing paralleled wide band gap power device power module | Brice McPherson, Peter Killeen, Alex Lostetter, Robert Shaw, Jared Hornberger +1 more | 2016-08-23 |
| 9407251 | Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration | Zach Cole, Bret Whitaker, Adam Barkley, Ty R. McNutt, Alexander Lostetter | 2016-08-02 |
| 9275938 | Low profile high temperature double sided flip chip power packaging | Brice McPherson, Adam Barkley, Robert Shaw | 2016-03-01 |
| 9018642 | Mid-infrared tunable metamaterials | Igal Brener, Xiaoyu Miao, Eric A. Shaner, Young Chul Jun | 2015-04-28 |