Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224233 | Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers | Kuldeep Saxena, Devarajan Balaraman | 2025-02-11 |
| D909310 | Power module | Brice McPherson, Zachary Cole, Jennifer Stabach, Brandon Passmore, Ty R. McNutt +1 more | 2021-02-02 |
| 10784235 | Silicon carbide power module | Brice McPherson, Zachary Cole, Jennifer Stabach, Brandon Passmore, Ty R. McNutt +1 more | 2020-09-22 |
| 10720380 | Flip-chip wire bondless power device | Michael D. Glover, H. Alan Mantooth | 2020-07-21 |