Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224233 | Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers | Sayan Seal, Kuldeep Saxena | 2025-02-11 |
| 12224218 | Semiconductor packages with increased power handling | Geza Dezsi, Brice McPherson | 2025-02-11 |
| 12205827 | Electronic device with top side pin array and manufacturing method thereof | Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne | 2025-01-21 |
| D1056862 | Semiconductor package | Geza Dezsi, Brice McPherson | 2025-01-07 |
| 10832921 | Electronic device with top side pin array and manufacturing method thereof | Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne | 2020-11-10 |
| 10304697 | Electronic device with top side pin array and manufacturing method thereof | Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne | 2019-05-28 |
| 10157872 | Semiconductor device and method of manufacturing thereof | Greg Hames, Glenn Rinne | 2018-12-18 |
| 10037957 | Semiconductor device and method of manufacturing thereof | Greg Hames, Glenn Rinne | 2018-07-31 |
| 8456016 | Method and core materials for semiconductor packaging | Yonggang Li, Amruthavalli Pallavi Alur, Xiwang Qi, Charan Gurumurthy | 2013-06-04 |
| 8174017 | Integrating three-dimensional high capacitance density structures | Markondeya Raj Pulugurtha, Isaac Abothu, Rao R. Tummala, Farrokh Ayazi | 2012-05-08 |
| 7749900 | Method and core materials for semiconductor packaging | Yonggang Li, Amruthavalli Pallavi Alur, Xiwang Qi, Charan Gurumurthy | 2010-07-06 |