Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205827 | Electronic device with top side pin array and manufacturing method thereof | Devarajan Balaraman, Greg Hames, Dean Zehnder, Glenn Rinne | 2025-01-21 |
| 11916033 | Method and system for packing optimization of semiconductor devices | Glenn Rinne | 2024-02-27 |
| 11562756 | Apparatus and method for post-processing an audio signal using prediction based shaping | Sascha Disch, Christian Uhle, Jürgen Herre, Peter Prokein, Patrick Gampp +3 more | 2023-01-24 |
| 11373666 | Apparatus for post-processing an audio signal using a transient location detection | Sascha Disch, Christian Uhle, Patrick Gampp, Oliver Hellmuth, Jürgen Herre +3 more | 2022-06-28 |
| 11239192 | Method and system for packing optimization of semiconductor devices | Glenn Rinne | 2022-02-01 |
| 10832921 | Electronic device with top side pin array and manufacturing method thereof | Devarajan Balaraman, Greg Hames, Dean Zehnder, Glenn Rinne | 2020-11-10 |
| 10734343 | Method and system for packing optimization of semiconductor devices | Glenn Rinne | 2020-08-04 |
| 10304697 | Electronic device with top side pin array and manufacturing method thereof | Devarajan Balaraman, Greg Hames, Dean Zehnder, Glenn Rinne | 2019-05-28 |
| 9478489 | Semiconductor dies with reduced area consumption | Frank Kuechenmeister | 2016-10-25 |
| 8664025 | Substrate dicing technique for separating semiconductor dies with reduced area consumption | Frank Kuechenmeister | 2014-03-04 |
| 7491556 | Efficient method of forming and assembling a microelectronic chip including solder bumps | Gotthard Jungnickel, Frank Kuechenmeister, Marcel Wieland | 2009-02-17 |