Daniel Richter has been granted 11 US patents while listed as an inventor at Amkor Technology . The first was granted in 2009 and the most recent in January 2025. Daniel Richter ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Daniel Richter in Goldsboro, NC, US.
Patents per Year Patents granted per year, 2009 to 2025 Bar chart with a peak of 2 patents in 2020. peak 2 2009: 1 patents 2009 2014: 1 patents 2014 2016: 1 patents 2016 2019: 1 patents 2019 2020: 2 patents 2020 2022: 2 patents 2022 2023: 1 patents 2023 2024: 1 patents 2024 2025: 1 patents 2025
Issued Patents All Time
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Showing 1–11 of 11 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
12205827 Electronic device with top side pin array and manufacturing method thereof Devarajan Balaraman , Greg Hames , Dean Zehnder , Glenn Rinne 2025-01-21
11916033 Method and system for packing optimization of semiconductor devices Glenn Rinne 2024-02-27
$20,650,000
11562756 Apparatus and method for post-processing an audio signal using prediction based shaping Sascha Disch , Christian Uhle , Jürgen Herre , Peter Prokein , Patrick Gampp +3 more 2023-01-24
11373666 Apparatus for post-processing an audio signal using a transient location detection Sascha Disch , Christian Uhle , Patrick Gampp , Oliver Hellmuth , Jürgen Herre +3 more 2022-06-28
11239192 Method and system for packing optimization of semiconductor devices Glenn Rinne 2022-02-01
$57,452,000
10832921 Electronic device with top side pin array and manufacturing method thereof Devarajan Balaraman , Greg Hames , Dean Zehnder , Glenn Rinne 2020-11-10
$20,879,000
10734343 Method and system for packing optimization of semiconductor devices Glenn Rinne 2020-08-04
$48,550,000
10304697 Electronic device with top side pin array and manufacturing method thereof Devarajan Balaraman , Greg Hames , Dean Zehnder , Glenn Rinne 2019-05-28
$4,607,000
9478489 Semiconductor dies with reduced area consumption Frank Kuechenmeister 2016-10-25
$3,817,000
8664025 Substrate dicing technique for separating semiconductor dies with reduced area consumption Frank Kuechenmeister 2014-03-04
$1,501,000
7491556 Efficient method of forming and assembling a microelectronic chip including solder bumps Gotthard Jungnickel , Frank Kuechenmeister , Marcel Wieland 2009-02-17
$4,823,000
