| 12205827 |
Electronic device with top side pin array and manufacturing method thereof |
Devarajan Balaraman, Greg Hames, Dean Zehnder, Glenn Rinne |
2025-01-21 |
| 11916033 |
Method and system for packing optimization of semiconductor devices |
Glenn Rinne |
2024-02-27 |
| 11562756 |
Apparatus and method for post-processing an audio signal using prediction based shaping |
Sascha Disch, Christian Uhle, Jürgen Herre, Peter Prokein, Patrick Gampp +3 more |
2023-01-24 |
| 11373666 |
Apparatus for post-processing an audio signal using a transient location detection |
Sascha Disch, Christian Uhle, Patrick Gampp, Oliver Hellmuth, Jürgen Herre +3 more |
2022-06-28 |
| 11239192 |
Method and system for packing optimization of semiconductor devices |
Glenn Rinne |
2022-02-01 |
| 10832921 |
Electronic device with top side pin array and manufacturing method thereof |
Devarajan Balaraman, Greg Hames, Dean Zehnder, Glenn Rinne |
2020-11-10 |
| 10734343 |
Method and system for packing optimization of semiconductor devices |
Glenn Rinne |
2020-08-04 |
| 10304697 |
Electronic device with top side pin array and manufacturing method thereof |
Devarajan Balaraman, Greg Hames, Dean Zehnder, Glenn Rinne |
2019-05-28 |
| 9478489 |
Semiconductor dies with reduced area consumption |
Frank Kuechenmeister |
2016-10-25 |
| 8664025 |
Substrate dicing technique for separating semiconductor dies with reduced area consumption |
Frank Kuechenmeister |
2014-03-04 |
| 7491556 |
Efficient method of forming and assembling a microelectronic chip including solder bumps |
Gotthard Jungnickel, Frank Kuechenmeister, Marcel Wieland |
2009-02-17 |
