| 8580672 |
Methods of forming bump structures that include a protection layer |
Frank Kuechenmeister, Lothar Lehmann, Alexander Platz, Sven Kosgalwies |
2013-11-12 |
| 8384218 |
Back side metallization with superior adhesion in high-performance semiconductor devices |
Soeren Zenner, Frank Kuechenmeister |
2013-02-26 |
| 7829453 |
Method for forming solder balls with a stable oxide layer by controlling the reflow ambient |
Alexander Platz, Frank Kuechenmeister |
2010-11-09 |
| 7585759 |
Technique for efficiently patterning an underbump metallization layer using a dry etch process |
Frank Kuechenmeister, Alexander Platz, Kerstin Siury |
2009-09-08 |
| 7569937 |
Technique for forming a copper-based contact layer without a terminal metal |
Frank Kuechenmeister, Matthias Lehr |
2009-08-04 |
| 7491556 |
Efficient method of forming and assembling a microelectronic chip including solder bumps |
Frank Kuechenmeister, Daniel Richter, Marcel Wieland |
2009-02-17 |
| 6720242 |
Method of forming a substrate contact in a field effect transistor formed over a buried insulator layer |
Gert Burbach, Frank Heinlein, Johannes Groschopf, Hartmut Ruelke, Carsten Hartig |
2004-04-13 |
