Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11907623 | Chip module structure and method and system for chip module design using chip-package co-optimization | Saquib B. Halim, Frank Kuechenmeister | 2024-02-20 |
| 11557421 | Integrated circuit structure with dielectric material to cover horizontally separated metal layers, and related method | Frank G. Küchenmeister, Hartmuth Daniel Kunze, Lothar Lehmann, Sven Bedürftig, Patrick Rohlfs | 2023-01-17 |
| 10594356 | Methods, apparatus, and system for high-bandwidth on-mold antennas | Saquib B. Halim, Md Sayed Kaysar Bin Rahim | 2020-03-17 |
| 10580745 | Wafer level packaging with integrated antenna structures | Christian Goetze | 2020-03-03 |
| 10411752 | Methods, apparatus, and system for high-bandwidth on-mold antennas | Saquib B. Halim, Md Sayed Kaysar Bin Rahim | 2019-09-10 |
| 9136234 | Semiconductor device with improved metal pillar configuration | Matthias Lehr, Martin O'Toole | 2015-09-15 |
| 7491556 | Efficient method of forming and assembling a microelectronic chip including solder bumps | Gotthard Jungnickel, Frank Kuechenmeister, Daniel Richter | 2009-02-17 |
| 7375032 | Semiconductor substrate thinning method for manufacturing thinned die | Frank Seliger, Matthias Lehr, Lothar Mergili, Frank Kuechenmeister | 2008-05-20 |