Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923397 | Through-substrate via structures in semiconductor devices | Mohamed Rabie | 2021-02-16 |
| 10712499 | Semiconductor devices and methods of forming same | Selaka Bandara Bulumulla, Tanya A. Atanasova | 2020-07-14 |