Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10712499 | Semiconductor devices and methods of forming same | Selaka Bandara Bulumulla, Md Sayed Kaysar Bin Rahim | 2020-07-14 |
| 10636759 | Methods of forming integrated circuit structure for joining wafers and resulting structure | Mukta G. Farooq | 2020-04-28 |
| 10236263 | Methods and structures for mitigating ESD during wafer bonding | Luke England, Daniel M. Smith, Daniel W. Fisher, Sukeshwar Kannan | 2019-03-19 |
| 10103119 | Methods of forming integrated circuit structure for joining wafers and resulting structure | Mukta G. Farooq | 2018-10-16 |
| 9214436 | Etching of under bump mettallization layer and resulting device | Reiner Willeke, Anh Duong | 2015-12-15 |
| 9159683 | Methods for etching copper during the fabrication of integrated circuits | Reiner Willeke, Anh Duong, Greg Nowling | 2015-10-13 |