Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955921 | System and method for improving color appearance of solar roofs | John Liu, Yangsen Kang, Yongkee Chae, Milan Padilla, Chen Wang +1 more | 2024-04-09 |
| 11431280 | System and method for improving color appearance of solar roofs | John Liu, Yangsen Kang, Yongkee Chae, Milan Padilla, Chen Wang +1 more | 2022-08-30 |
| 9399753 | Aqua regia and hydrogen peroxide HCL combination to remove Ni and NiPt residues | Clemens Fitz, Olov Karlsson | 2016-07-26 |
| 9343408 | Method to etch Cu/Ta/TaN selectively using dilute aqueous HF/H2SO4 solution | Errol Todd Ryan | 2016-05-17 |
| 9337030 | Method to grow in-situ crystalline IGZO using co-sputtering targets | Seon-Mee Cho, Stuart Brinkley, Majid Gharghi, Sang Lee, Minh Huu Le +2 more | 2016-05-10 |
| 9245848 | Methods for coating a substrate with an amphiphilic compound | Tony P. Chiang, Zachary Fresco, Nitin Kumar, Chi-I Lang, Jinhong Tong +1 more | 2016-01-26 |
| 9224639 | Method to etch cu/Ta/TaN selectively using dilute aqueous Hf/hCl solution | Errol Todd Ryan | 2015-12-29 |
| 9214436 | Etching of under bump mettallization layer and resulting device | Tanya A. Atanasova, Reiner Willeke | 2015-12-15 |
| 9159683 | Methods for etching copper during the fabrication of integrated circuits | Reiner Willeke, Tanya A. Atanasova, Greg Nowling | 2015-10-13 |
| 9123785 | Method to etch Cu/Ta/TaN selectively using dilute aqueous HF/HCI solution | Errol Todd Ryan | 2015-09-01 |
| 9012322 | Selective etching of copper and copper-barrier materials by an aqueous base solution with fluoride addition | Errol Todd Ryan | 2015-04-21 |
| 8946015 | Aqua regia and hydrogen peroxide HCI combination to remove Ni and NiPt residues | Clemens Fitz, Olov Karlsson | 2015-02-03 |
| 8926758 | Composition and method for removing photoresist and bottom anti-reflective coating for a semiconductor substrate | Indranil De | 2015-01-06 |
| 8894774 | Composition and method to remove excess material during manufacturing of semiconductor devices | — | 2014-11-25 |
| 8871860 | Methods for coating a substrate with an amphiphilic compound | Tony P. Chiang, Zachary Fresco, Nitin Kumar, Chi-I Lang, Jinhong Tong +1 more | 2014-10-28 |
| 8859431 | Process to remove Ni and Pt residues for NiPtSi application using chlorine gas | John Foster, Olov Karlsson, James Mavrinac, Usha Raghuram | 2014-10-14 |
| 8853081 | High dose ion-implanted photoresist removal using organic solvent and transition metal mixtures | Olov Karlsson, Sven Metzger | 2014-10-07 |
| 8833454 | Hydrocarbon recovery method | — | 2014-09-16 |
| 8809140 | Aqua regia and hydrogen peroxide HCl combination to remove Ni and NiPt residues | Clemens Fitz, Olov Karlsson | 2014-08-19 |
| 8784572 | Method for cleaning platinum residues on a semiconductor substrate | Sean Barstow, Olov Karlsson, Bei Li, James Mavrinac | 2014-07-22 |
| 8697573 | Process to remove Ni and Pt residues for NiPtSi applications using aqua regia with microwave assisted heating | Olov Karlsson | 2014-04-15 |
| 8664014 | High productivity combinatorial workflow for photoresist strip applications | Bei Li, Sean Barstow, Zhendong Hong, Ashley Lacey | 2014-03-04 |
| 8575021 | Substrate processing including a masking layer | Thomas R. Boussie, Tony P. Chiang, Zachary Fresco, Nitin Kumar, Chi-I Lang +2 more | 2013-11-05 |
| 8535972 | Methods for coating a substrate with an amphiphilic compound | Zachary Fresco, Chi-I Lang, Jinhong Tong, Nitin Kumar, Anna Tsimelzon +1 more | 2013-09-17 |
| 8518765 | Aqua regia and hydrogen peroxide HCl combination to remove Ni and NiPt residues | Clemens Fitz, Olov Karlsson | 2013-08-27 |