Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773744 | Solder bump cleaning before reflow | Sören Zenner | 2017-09-26 |
| 9214436 | Etching of under bump mettallization layer and resulting device | Tanya A. Atanasova, Anh Duong | 2015-12-15 |
| 9159683 | Methods for etching copper during the fabrication of integrated circuits | Tanya A. Atanasova, Anh Duong, Greg Nowling | 2015-10-13 |