Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10236263 | Methods and structures for mitigating ESD during wafer bonding | Luke England, Tanya A. Atanasova, Daniel M. Smith, Sukeshwar Kannan | 2019-03-19 |
| 9711447 | Self-aligned lithographic patterning with variable spacings | Jiehui Shu, Qiang Fang, Haigou Huang, Jinping Liu, Haifeng Sheng +1 more | 2017-07-18 |