DS

Daniel M. Smith

OR Ortronics: 9 patents #9 of 68Top 15%
Micron: 8 patents #1,691 of 6,345Top 30%
Globalfoundries: 5 patents #673 of 4,424Top 20%
LD Legrand Dpc: 4 patents #1 of 34Top 3%
Motorola: 3 patents #3,303 of 12,470Top 30%
Google: 3 patents #8,000 of 22,993Top 35%
FG Fossil Group: 1 patents #31 of 70Top 45%
Overall (All Time): #96,211 of 4,157,543Top 3%
35
Patents All Time

Issued Patents All Time

Showing 25 most recent of 35 patents

Patent #TitleCo-InventorsDate
12265267 Angle polishing systems and methods for multi-ferrule optical connectors Ryan J. Grandidge, Thomas Knychalski, Robert E. Abel 2025-04-01
12158621 Interstitial recessed cantilever latch mechanism for fiber optic and electrical connectors William M. Smith 2024-12-03
12075592 Modular cable management device Thomas Knychalski, Ryan J. Grandidge, Michael J. Moldoch 2024-08-27
12010810 Extendable cable enclosure Thomas Knychalski, Ryan J. Grandidge 2024-06-11
11825622 Single-board computer cartridge 2023-11-21
11714236 Single-station splicing unit and method Ryan J. Grandidge 2023-08-01
11448833 Angle polishing systems and methods for multi-ferrule optical connectors Ryan J. Grandidge, Thomas Knychalski, Robert E. Abel 2022-09-20
11370588 Packaging assemblies for optical fiber applications Ryan J. Grandidge 2022-06-28
11369034 Ejectable cassette, guide column, and ejectable cassette system Thomas Knychalski, Ryan J. Grandidge, Rudolph A. Montgelas 2022-06-21
10996406 Multichannel fiber optic connector, adapter, and contact retention method William M. Smith 2021-05-04
10788640 Splice managers and related methods of use Ryan J. Grandidge, Rudolph A. Montgelas 2020-09-29
10591681 Multichannel fiber optic connector, adapter, and contact retention method William M. Smith 2020-03-17
10585257 Printable color-coded pattern label array for patch field applications 2020-03-10
10446443 Integrated circuit product having a through-substrate-via (TSV) and a metallization layer that are formed after formation of a semiconductor device Himani Suhag Kamineni, Vimal Kamineni, Maxwell Lippitt 2019-10-15
10236263 Methods and structures for mitigating ESD during wafer bonding Luke England, Tanya A. Atanasova, Daniel W. Fisher, Sukeshwar Kannan 2019-03-19
10187706 Snap clip fastener assembly 2019-01-22
10168502 Fiber cassette and adapter module with slide lock Ryan J. Grandidge, Normand James Roy, Michael J. Moldoch, James P. Quinn 2019-01-01
10162129 Internal harnessing members and method for bend control of optical fibers in connector assemblies Ryan J. Grandidge, James Lucy, Alex Richard, Randy Harris 2018-12-25
10083958 Deep trench metal-insulator-metal capacitors Sukeshwar Kannan, Somnath Ghosh, Luke England 2018-09-25
9917009 Methods of forming a through-substrate-via (TSV) and a metallization layer after formation of a semiconductor device Himani Suhag Kamineni, Vimal Kamineni, Maxwell Lippitt 2018-03-13
9349608 Methods of protecting a dielectric mask layer and related semiconductor devices Zhiguo Sun, Kumarapuram Gopalakrishnan, Hung-Wei Liu 2016-05-24
6893949 Semiconductor devices having contact plugs and local interconnects and methods for making the same Sanh D. Tang, Jason Taylor 2005-05-17
6734071 Methods of forming insulative material against conductive structures Jeffrey W. Honeycutt, Hassan Shahjamali 2004-05-11
6700205 Semiconductor devices having contact plugs and local interconnects Sanh D. Tang, Jason Taylor 2004-03-02
6501140 Transistor structures Jeffrey W. Honeycutt, Hassan Shahjamali 2002-12-31