Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446443 | Integrated circuit product having a through-substrate-via (TSV) and a metallization layer that are formed after formation of a semiconductor device | Vimal Kamineni, Daniel M. Smith, Maxwell Lippitt | 2019-10-15 |
| 9917009 | Methods of forming a through-substrate-via (TSV) and a metallization layer after formation of a semiconductor device | Vimal Kamineni, Daniel M. Smith, Maxwell Lippitt | 2018-03-13 |
| 9123787 | Through-silicon via unit cell with keep out zones and center point aligned probe pad, and method of forming | Ramakanth Alapati, Maria Balicka | 2015-09-01 |