| 12242123 |
Photonic quantum computer assembly with a quantum computing die facing an electronic circuit die |
Gabriel J. Mendoza, Matteo Staffaroni, Albert Wang, John E. Berg |
2025-03-04 |
|
| 12221339 |
Semiconductor device and method of manufacturing semiconductor device |
Ki Yeul Yang, Kyung Han Ryu, Seok Hun YUN, Bora Baloglu, Hyun Cho |
2025-02-11 |
|
| 12130195 |
Active alignment of optical die to optical substrates |
Bradley Snyder, Gabriel J. Mendoza, Soumyadipta Basu |
2024-10-29 |
|
| 12100701 |
Hybrid system including photonic and electronic integrated circuits and cooling plate |
Gabriel J. Mendoza |
2024-09-24 |
|
| 12087623 |
Dielectric liners on through glass vias |
M Ziaul Karim, Christopher Lane |
2024-09-10 |
|
| 11897761 |
Semiconductor device and method of manufacturing semiconductor device |
Ki Yeul Yang, Kyung Han Ryu, Seok Hun YUN, Bora Baloglu, Hyun Cho |
2024-02-13 |
$15,122,000 |
| 11892693 |
Photonic quantum computer assembly |
Gabriel J. Mendoza, Matteo Staffaroni, Albert Wang, John E. Berg |
2024-02-06 |
|
| 11784457 |
Semiconductor device and method of manufacturing a semiconductor device |
Darrell Paul Baker, Anthony B. Taguinod |
2023-10-10 |
$25,664,000 |
| 11742327 |
Semiconductor devices and methods of manufacturing semiconductor devices |
Shaun Bowers |
2023-08-29 |
$13,577,000 |
| 11670627 |
Hybrid system including photonic and electronic integrated circuits and cooling plate |
Gabriel J. Mendoza |
2023-06-06 |
|
| 11588009 |
Semiconductor device having a lid configured as an enclosure and a capacitive structure and method of manufacturing a semiconductor device |
— |
2023-02-21 |
$54,339,000 |
| 11550108 |
Quantum computing die assembly with thru-silicon vias |
Gabriel J. Mendoza, Matteo Staffaroni, Albert Wang, John E. Berg |
2023-01-10 |
|
| 11493713 |
Photonic quantum computer assembly having dies with specific contact configuration and matched CTE |
Gabriel J. Mendoza, Matteo Staffaroni, Albert Wang, John E. Berg |
2022-11-08 |
|
| 11493714 |
Quantum computing die assembly with thru-silicon vias and connected logic circuit |
Gabriel J. Mendoza, Matteo Staffaroni, Albert Wang, John E. Berg |
2022-11-08 |
|
| 11352252 |
Semiconductor device and method of manufacturing semiconductor device |
Ki Yeul Yang, Kyung Han Ryu, Seok Hun YUN, Bora Baloglu, Hyun Cho |
2022-06-07 |
$10,659,000 |
| 11133642 |
Semiconductor device and method of manufacturing a semiconductor device |
Darrell Paul Baker, Anthony B. Taguinod |
2021-09-28 |
$70,179,000 |
| 11107799 |
Hybrid system including photonic and electronic integrated circuits and cooling plate |
Gabriel J. Mendoza |
2021-08-31 |
|
| 11035752 |
Active alignment of optical die to optical substrates |
Bradley Snyder, Gabriel J. Mendoza, Soumyadipta Basu |
2021-06-15 |
|
| 11024604 |
Semiconductor devices and methods of manufacturing semiconductor devices |
Shaun Bowers |
2021-06-01 |
$62,855,000 |
| 10644479 |
Semiconductor device and method of manufacturing a semiconductor device |
Darrell Paul Baker, Anthony B. Taguinod |
2020-05-05 |
$35,749,000 |
| 9711662 |
Integrated circuits with optical modulators and photodetectors and methods for producing the same |
Shunqiang Gong, Benfu Lin, Juan Boon Tan |
2017-07-18 |
|
| 9553080 |
Method and process for integration of TSV-middle in 3D IC stacks |
Luke England |
2017-01-24 |
$6,909,000 |
| 9318466 |
Method for electronic circuit assembly on a paper substrate |
Saket Chadda, Adam BEECE |
2016-04-19 |
$757,000 |
| 9184159 |
Simplified pitch doubling process flow |
Ardavan Niroomand, Baosuo Zhou |
2015-11-10 |
$7,276,000 |
| 9123787 |
Through-silicon via unit cell with keep out zones and center point aligned probe pad, and method of forming |
Himani Suhag Kamineni, Maria Balicka |
2015-09-01 |
$963,000 |
