Issued Patents All Time
Showing 25 most recent of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12242123 | Photonic quantum computer assembly with a quantum computing die facing an electronic circuit die | Gabriel J. Mendoza, Matteo Staffaroni, Albert Wang, John E. Berg | 2025-03-04 |
| 12221339 | Semiconductor device and method of manufacturing semiconductor device | Ki Yeul Yang, Kyung Han Ryu, Seok Hun YUN, Bora Baloglu, Hyun Cho | 2025-02-11 |
| 12130195 | Active alignment of optical die to optical substrates | Bradley Snyder, Gabriel J. Mendoza, Soumyadipta Basu | 2024-10-29 |
| 12100701 | Hybrid system including photonic and electronic integrated circuits and cooling plate | Gabriel J. Mendoza | 2024-09-24 |
| 12087623 | Dielectric liners on through glass vias | M Ziaul Karim, Christopher Lane | 2024-09-10 |
| 11897761 | Semiconductor device and method of manufacturing semiconductor device | Ki Yeul Yang, Kyung Han Ryu, Seok Hun YUN, Bora Baloglu, Hyun Cho | 2024-02-13 |
| 11892693 | Photonic quantum computer assembly | Gabriel J. Mendoza, Matteo Staffaroni, Albert Wang, John E. Berg | 2024-02-06 |
| 11784457 | Semiconductor device and method of manufacturing a semiconductor device | Darrell Paul Baker, Anthony B. Taguinod | 2023-10-10 |
| 11742327 | Semiconductor devices and methods of manufacturing semiconductor devices | Shaun Bowers | 2023-08-29 |
| 11670627 | Hybrid system including photonic and electronic integrated circuits and cooling plate | Gabriel J. Mendoza | 2023-06-06 |
| 11588009 | Semiconductor device having a lid configured as an enclosure and a capacitive structure and method of manufacturing a semiconductor device | — | 2023-02-21 |
| 11550108 | Quantum computing die assembly with thru-silicon vias | Gabriel J. Mendoza, Matteo Staffaroni, Albert Wang, John E. Berg | 2023-01-10 |
| 11493713 | Photonic quantum computer assembly having dies with specific contact configuration and matched CTE | Gabriel J. Mendoza, Matteo Staffaroni, Albert Wang, John E. Berg | 2022-11-08 |
| 11493714 | Quantum computing die assembly with thru-silicon vias and connected logic circuit | Gabriel J. Mendoza, Matteo Staffaroni, Albert Wang, John E. Berg | 2022-11-08 |
| 11352252 | Semiconductor device and method of manufacturing semiconductor device | Ki Yeul Yang, Kyung Han Ryu, Seok Hun YUN, Bora Baloglu, Hyun Cho | 2022-06-07 |
| 11133642 | Semiconductor device and method of manufacturing a semiconductor device | Darrell Paul Baker, Anthony B. Taguinod | 2021-09-28 |
| 11107799 | Hybrid system including photonic and electronic integrated circuits and cooling plate | Gabriel J. Mendoza | 2021-08-31 |
| 11035752 | Active alignment of optical die to optical substrates | Bradley Snyder, Gabriel J. Mendoza, Soumyadipta Basu | 2021-06-15 |
| 11024604 | Semiconductor devices and methods of manufacturing semiconductor devices | Shaun Bowers | 2021-06-01 |
| 10644479 | Semiconductor device and method of manufacturing a semiconductor device | Darrell Paul Baker, Anthony B. Taguinod | 2020-05-05 |
| 9711662 | Integrated circuits with optical modulators and photodetectors and methods for producing the same | Shunqiang Gong, Benfu Lin, Juan Boon Tan | 2017-07-18 |
| 9553080 | Method and process for integration of TSV-middle in 3D IC stacks | Luke England | 2017-01-24 |
| 9318466 | Method for electronic circuit assembly on a paper substrate | Saket Chadda, Adam BEECE | 2016-04-19 |
| 9184159 | Simplified pitch doubling process flow | Ardavan Niroomand, Baosuo Zhou | 2015-11-10 |
| 9123787 | Through-silicon via unit cell with keep out zones and center point aligned probe pad, and method of forming | Himani Suhag Kamineni, Maria Balicka | 2015-09-01 |