| 12221339 |
Semiconductor device and method of manufacturing semiconductor device |
Ki Yeul Yang, Kyung Han Ryu, Seok Hun YUN, Hyun Cho, Ramakanth Alapati |
2025-02-11 |
|
| 12015000 |
Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof |
Curtis Zwenger, Ron Huemoeller |
2024-06-18 |
$87,254,000 |
| 11915949 |
Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby |
Suresh Jayaraman, Ronald Patrick Huemoeller, Andre Cardoso, Eoin O'Toole, Marta Sa Santos +4 more |
2024-02-27 |
$20,650,000 |
| 11897761 |
Semiconductor device and method of manufacturing semiconductor device |
Ki Yeul Yang, Kyung Han Ryu, Seok Hun YUN, Hyun Cho, Ramakanth Alapati |
2024-02-13 |
$15,122,000 |
| 11901343 |
Semiconductor device with integrated heat distribution and manufacturing method thereof |
Ron Huemoeller, Curtis Zwenger |
2024-02-13 |
$15,122,000 |
| 11823913 |
Method of manufacturing an electronic device and electronic device manufactured thereby |
Curtis Zwenger, Ronald Patrick Huemoeller |
2023-11-21 |
$58,839,000 |
| 11784101 |
Semiconductor devices comprising a lid structure and methods of manufacturing semiconductor devices comprising a lid structure |
Shaun Bowers |
2023-10-10 |
$25,664,000 |
| 11605552 |
Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby |
Suresh Jayaraman, Ronald Patrick Huemoeller, Andre Cardoso, Eoin O'Toole |
2023-03-14 |
$50,008,000 |
| 11444013 |
Semiconductor device and manufacturing method thereof |
Ron Huemoeller, Curtis Zwenger |
2022-09-13 |
$44,288,000 |
| 11352252 |
Semiconductor device and method of manufacturing semiconductor device |
Ki Yeul Yang, Kyung Han Ryu, Seok Hun YUN, Hyun Cho, Ramakanth Alapati |
2022-06-07 |
$10,659,000 |
| 11031259 |
Method of manufacturing an electronic device and electronic device manufactured thereby |
Curtis Zwenger, Ronald Patrick Huemoeller |
2021-06-08 |
$16,684,000 |
| 11018102 |
Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof |
Curtis Zwenger, Ron Huemoeller |
2021-05-25 |
$12,414,000 |
| 10985146 |
Semiconductor device with integrated heat distribution and manufacturing method thereof |
Ron Huemoeller, Curtis Zwenger |
2021-04-20 |
$33,983,000 |
| 10861798 |
Embedded vibration management system having an array of vibration absorbing structures |
Adrian Arcedera, Marc Alan Mangrum, Russell Shumway |
2020-12-08 |
$23,828,000 |
| 10790161 |
Electronic device with adaptive vertical interconnect and fabricating method thereof |
Curtis Zwenger, Ronald Patrick Huemoeller |
2020-09-29 |
$41,903,000 |
| 10504827 |
Semiconductor device and manufacturing method thereof |
Ron Huemoeller, Curtis Zwenger |
2019-12-10 |
|
| 10468272 |
Method of manufacturing an electronic device and electronic device manufactured thereby |
Curtis Zwenger, Ronald Patrick Huemoeller |
2019-11-05 |
|
| 10438910 |
Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof |
Curtis Zwenger, Ron Huemoeller |
2019-10-08 |
|
| 10410999 |
Semiconductor device with integrated heat distribution and manufacturing method thereof |
Ron Huemoeller, Curtis Zwenger |
2019-09-10 |
|
| 10134635 |
Stress relieving through-silicon vias |
Ronald Patrick Huemoeller |
2018-11-20 |
$6,708,000 |
| 10062611 |
Encapsulated semiconductor package and method of manufacturing thereof |
Curtis Zwenger, Ron Huemoeller |
2018-08-28 |
$7,517,000 |
| 10032726 |
Embedded vibration management system |
Adrian Arcedera, Marc Alan Mangrum, Russell Shumway |
2018-07-24 |
$2,669,000 |
| 9905440 |
Method of manufacturing an electronic device and electronic device manufactured thereby |
Curtis Zwenger, Ronald Patrick Huemoeller |
2018-02-27 |
$19,538,000 |
| 9741617 |
Encapsulated semiconductor package and method of manufacturing thereof |
Curtis Zwenger, Ron Huemoeller |
2017-08-22 |
$8,642,000 |
| 9607890 |
Stress relieving through-silicon vias |
Ronald Patrick Huemoeller |
2017-03-28 |
$11,703,000 |