Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9559075 | Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof | Curtis Zwenger, Ron Huemoeller | 2017-01-31 |
| 9349613 | Electronic package with embedded materials in a molded structure to control warpage and stress | Jeffrey Watson | 2016-05-24 |
| 9269872 | Molded electronic package geometry to control warpage and die stress | Jeffrey Watson | 2016-02-23 |
| 8986806 | Warpage control stiffener ring package and fabrication method | Jeff Watson | 2015-03-24 |
| 8940587 | Die seal design and method and apparatus for integrated circuit production | — | 2015-01-27 |