Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9349613 | Electronic package with embedded materials in a molded structure to control warpage and stress | Bora Baloglu | 2016-05-24 | $5,703,000 |
| 9269872 | Molded electronic package geometry to control warpage and die stress | Bora Baloglu | 2016-02-23 | $14,299,000 |
| 7588965 | Stencil and method for depositing material onto a substrate | — | 2009-09-15 | $19,566,000 |
| 7228622 | Electronic device carrier and manufacture tape | — | 2007-06-12 | $15,149,000 |
| 7127805 | Electronic device carrier and manufacturing tape | — | 2006-10-31 | $18,482,000 |
| 7129590 | Stencil and method for depositing material onto a substrate | — | 2006-10-31 | $18,482,000 |
| 6129256 | Reflow furnace for an electronic assembly | Kiet M. Van, Steven B. Roach | 2000-10-10 | $223,559,000 |