Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic package with embedded materials in a molded structure to control warpage and stress

Electronic package with embedded materials in a molded structure to control warpage and stress

US Patent 9349613 · Granted May 24, 2016

Estimated economic value: $5,703,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of manufacturing semiconductor device2025
Semiconductor product with interlocking metal-to-metal bonds and method for manu2024
Hybrid panel method of manufacturing electronic devices and electronic devices m2024
Semiconductor device and method of manufacturing semiconductor device2024
Semiconductor device with integrated heat distribution and manufacturing method 2024
Method of manufacturing an electronic device and electronic device manufactured 2023
Semiconductor devices comprising a lid structure and methods of manufacturing se2023
Hybrid panel method of manufacturing electronic devices and electronic devices m2023
Semiconductor device and manufacturing method thereof2022
Semiconductor device and method of manufacturing semiconductor device2022
Method of manufacturing an electronic device and electronic device manufactured 2021
Semiconductor product with interlocking metal-to-metal bonds and method for manu2021