Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861798 | Embedded vibration management system having an array of vibration absorbing structures | Bora Baloglu, Adrian Arcedera, Marc Alan Mangrum | 2020-12-08 |
| 10032726 | Embedded vibration management system | Bora Baloglu, Adrian Arcedera, Marc Alan Mangrum | 2018-07-24 |
| 9758372 | MEMS package with MEMS die, magnet, and window substrate fabrication method and structure | Bob Shih-Wei Kuo, Shaun Bowers | 2017-09-12 |
| 9670445 | Microfluidics sensor package fabrication method and structure | Bob Shih-Wei Kuo | 2017-06-06 |
| 9346668 | Molded cavity substrate MEMS package fabrication method and structure | Mahmoud Dreiza, Andrew Ballantine | 2016-05-24 |
| 9162871 | Metal mesh lid MEMS package and method | Bob Shih-Wei Kuo, Louis B. Troche, Jr. | 2015-10-20 |
| 9029962 | Molded cavity substrate MEMS package fabrication method and structure | Mahmoud Dreiza, Andrew Ballantine | 2015-05-12 |
| 9013011 | Stacked and staggered die MEMS package and method | Bob Shih-Wei Kuo, Brett Dunlap, Louis B. Troche, Jr., Ahmer Syed | 2015-04-21 |
| 8536663 | Metal mesh lid MEMS package and method | Bob Shih-Wei Kuo, Louis B. Troche, Jr. | 2013-09-17 |
| 7834431 | Leadframe for packaged electronic device with enhanced mold locking capability | Stephen R. Hooper, James D. MacDonald, Jr. | 2010-11-16 |
| 7208841 | Semiconductor device with strain relieving bump design | James Jen-Ho Wang, Jin-Wook Jang, Alfredo V. Mendoza, Rajashi Runton | 2007-04-24 |
| 6790759 | Semiconductor device with strain relieving bump design | James Jen-Ho Wang, Jin-Wook Jang, Alfredo V. Mendoza, Rajashi Runton | 2004-09-14 |