Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12035472 | Stackable via package and method | Akito Yoshida, Curtis Zwenger | 2024-07-09 |
| 11700692 | Stackable via package and method | Akito Yoshida, Curtis Zwenger | 2023-07-11 |
| 11089685 | Stackable via package and method | Akito Yoshida, Curtis Zwenger | 2021-08-10 |
| 10548221 | Stackable via package and method | Akito Yoshida, Curtis Zwenger | 2020-01-28 |
| 10257942 | Stackable variable height via package and method | Akito Yoshida | 2019-04-09 |
| 10206285 | Stackable via package and method | Akito Yoshida, Curtis Zwenger | 2019-02-12 |
| 10034372 | Stackable via package and method | Akito Yoshida, Curtis Zwenger | 2018-07-24 |
| 9730327 | Stackable via package and method | Akito Yoshida, Curtis Zwenger | 2017-08-08 |
| 9346668 | Molded cavity substrate MEMS package fabrication method and structure | Andrew Ballantine, Russell Shumway | 2016-05-24 |
| 9029962 | Molded cavity substrate MEMS package fabrication method and structure | Andrew Ballantine, Russell Shumway | 2015-05-12 |
| 9012789 | Stackable via package and method | Akito Yoshida, Curtis Zwenger | 2015-04-21 |
| 8704368 | Stackable via package and method | Akito Yoshida, Curtis Zwenger | 2014-04-22 |
| 8623753 | Stackable protruding via package and method | Akito Yoshida, Curtis Zwenger | 2014-01-07 |
| 8471154 | Stackable variable height via package and method | Akito Yoshida | 2013-06-25 |
| 8222538 | Stackable via package and method | Akito Yoshida, Curtis Zwenger | 2012-07-17 |
| 8022521 | Package failure prognostic structure and method | Akito Yoshida | 2011-09-20 |
| 7960827 | Thermal via heat spreader package and method | August Joseph Miller, Jr., Jeffrey Alan Miks, Christopher M. Scanlan | 2011-06-14 |
| 7691745 | Land patterns for a semiconductor stacking structure and method therefor | Akito Yoshida | 2010-04-06 |
| 7652361 | Land patterns for a semiconductor stacking structure and method therefor | Akito Yoshida, James William Griffith Turner | 2010-01-26 |
| 7429799 | Land patterns for a semiconductor stacking structure and method therefor | Akito Yoshida | 2008-09-30 |