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USPTO Patent Rankings Data through Dec 31, 2025
Home › Deca Technologies › Christopher M. Scanlan
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Christopher M. Scanlan — 70 Patents

DTDeca Technologies: 37 patents #1 of 12Top 9%
ATAmkor Technology: 30 patents #14 of 595Top 3%
Motorola: 3 patents #4,864 of 14,142Top 35%
TATyco Electronics Logistics Ag: 2 patents #30 of 200Top 15%
Chandler, AZ: #40 of 3,331 inventorsTop 2%
Arizona: #243 of 32,909 inventorsTop 1%
Overall (All Time): #29,186 of 4,157,543Top 1%
70 Patents All Time
Christopher M. Scanlan has been granted 70 US patents while listed as an inventor at Deca Technologies. The first was granted in 1998 and the most recent in October 2020. Christopher M. Scanlan ranks #29,186 of 4,157,543 US inventors in our database (top 0.70%). Patent records list Christopher M. Scanlan in Chandler, AZ, US.

Issued Patents All Time

Showing 1–25 of 70 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
10818635 Fully molded semiconductor package for power devices and method of making the same Timothy L. Olson 2020-10-27
10720417 Thermally enhanced fully molded fan-out module — 2020-07-21
10672624 Method of making fully molded peripheral package on package device William Boyd Rogers, Craig Bishop 2020-06-02
10573601 Semiconductor device and method of unit specific progressive alignment Craig Bishop 2020-02-25
10373902 Fully molded miniaturized semiconductor module Timothy L. Olson 2019-08-06
10373870 Semiconductor device and method of packaging Timothy L. Olson 2019-08-06
10373913 Method of marking a semiconductor package — 2019-08-06
10157803 Semiconductor device and method of unit specific progressive alignment Craig Bishop 2018-12-18
10056304 Automated optical inspection of unit specific patterning Craig Bishop, Vaibhav Joga Singh Bora, Timothy L. Olson 2018-08-21
10050004 Fully molded peripheral package on package device William Boyd Rogers, Craig Bishop 2018-08-14
9978655 Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping Craig Bishop 2018-05-22
9887103 Semiconductor device and method of adaptive patterning for panelized packaging Timothy L. Olson 2018-02-06
9831170 Fully molded miniaturized semiconductor module Timothy L. Olson 2017-11-28
9768124 Semiconductor package in package Christopher J. Berry 2017-09-19 $19,763,000
9761571 Thermally enhanced fully molded fan-out module — 2017-09-12
9754835 Semiconductor device and method comprising redistribution layers Craig Bishop 2017-09-05
9613912 Method of marking a semiconductor package — 2017-04-04
9613830 Fully molded peripheral package on package device William Boyd Rogers, Craig Bishop 2017-04-04
9576919 Semiconductor device and method comprising redistribution layers Craig Bishop 2017-02-21
9520331 Adaptive patterning for panelized packaging Timothy L. Olson 2016-12-13
9520364 Front side package-level serialization for packages comprising unique identifiers Craig Bishop, Sabbas A. Daniel 2016-12-13
9502397 3D interconnect component for fully molded packages — 2016-11-22
9466545 Semiconductor package in package Christopher J. Berry 2016-10-11 $11,721,000
9464362 Magnetically sealed wafer plating jig system and method Ferdinand Aldas, Kenneth C. Blaisdell, Cheryl R. Abanes 2016-10-11
9418905 Adaptive patterning for panelized packaging Timothy L. Olson 2016-08-16

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