Issued Patents All Time
Showing 25 most recent of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818635 | Fully molded semiconductor package for power devices and method of making the same | Timothy L. Olson | 2020-10-27 |
| 10720417 | Thermally enhanced fully molded fan-out module | — | 2020-07-21 |
| 10672624 | Method of making fully molded peripheral package on package device | William Boyd Rogers, Craig Bishop | 2020-06-02 |
| 10573601 | Semiconductor device and method of unit specific progressive alignment | Craig Bishop | 2020-02-25 |
| 10373902 | Fully molded miniaturized semiconductor module | Timothy L. Olson | 2019-08-06 |
| 10373870 | Semiconductor device and method of packaging | Timothy L. Olson | 2019-08-06 |
| 10373913 | Method of marking a semiconductor package | — | 2019-08-06 |
| 10157803 | Semiconductor device and method of unit specific progressive alignment | Craig Bishop | 2018-12-18 |
| 10056304 | Automated optical inspection of unit specific patterning | Craig Bishop, Vaibhav Joga Singh Bora, Timothy L. Olson | 2018-08-21 |
| 10050004 | Fully molded peripheral package on package device | William Boyd Rogers, Craig Bishop | 2018-08-14 |
| 9978655 | Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping | Craig Bishop | 2018-05-22 |
| 9887103 | Semiconductor device and method of adaptive patterning for panelized packaging | Timothy L. Olson | 2018-02-06 |
| 9831170 | Fully molded miniaturized semiconductor module | Timothy L. Olson | 2017-11-28 |
| 9768124 | Semiconductor package in package | Christopher J. Berry | 2017-09-19 |
| 9761571 | Thermally enhanced fully molded fan-out module | — | 2017-09-12 |
| 9754835 | Semiconductor device and method comprising redistribution layers | Craig Bishop | 2017-09-05 |
| 9613912 | Method of marking a semiconductor package | — | 2017-04-04 |
| 9613830 | Fully molded peripheral package on package device | William Boyd Rogers, Craig Bishop | 2017-04-04 |
| 9576919 | Semiconductor device and method comprising redistribution layers | Craig Bishop | 2017-02-21 |
| 9520331 | Adaptive patterning for panelized packaging | Timothy L. Olson | 2016-12-13 |
| 9520364 | Front side package-level serialization for packages comprising unique identifiers | Craig Bishop, Sabbas A. Daniel | 2016-12-13 |
| 9502397 | 3D interconnect component for fully molded packages | — | 2016-11-22 |
| 9466545 | Semiconductor package in package | Christopher J. Berry | 2016-10-11 |
| 9464362 | Magnetically sealed wafer plating jig system and method | Ferdinand Aldas, Kenneth C. Blaisdell, Cheryl R. Abanes | 2016-10-11 |
| 9418905 | Adaptive patterning for panelized packaging | Timothy L. Olson | 2016-08-16 |