Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990435 | Fingerprint sensor and manufacturing method thereof | Sung-Sun Park, Ji Young Chung | 2024-05-21 |
| 11621243 | Thin bonded interposer package | Roger D. St. Amand, Jin Seong Kim | 2023-04-04 |
| 11393734 | Fingerprint sensor and manufacturing method thereof | Sung-Sun Park, Ji Young Chung | 2022-07-19 |
| 10818637 | Thin bonded interposer package | Roger D. St. Amand, Jin Seong Kim | 2020-10-27 |
| 10446455 | Fingerprint sensor and manufacturing method thereof | Sung-Sun Park, Ji Young Chung | 2019-10-15 |
| 10297515 | Fingerprint sensor and manufacturing method thereof | Sung-Sun Park, Ji Young Chung | 2019-05-21 |
| 10242966 | Thin bonded interposer package | Roger D. St. Amand, Jin Seong Kim | 2019-03-26 |
| 9875980 | Copper pillar sidewall protection | Glenn Rinne, Dean Zehnder, Robert Lanzone, Ludovico E. Bancod | 2018-01-23 |
| 9768124 | Semiconductor package in package | Christopher M. Scanlan | 2017-09-19 |
| 9711485 | Thin bonded interposer package | Roger D. St.Amand, Jin Seong Kim | 2017-07-18 |
| 9466545 | Semiconductor package in package | Christopher M. Scanlan | 2016-10-11 |
| 8643177 | Wafers including patterned back side layers thereon | Glenn Rinne, Kevin Engel, Julia Roe | 2014-02-04 |
| 8501543 | Direct-write wafer level chip scale package | Ronald Patrick Huemoeller, David Jon Hiner | 2013-08-06 |
| 8365611 | Bend test method and apparatus for flip chip devices | Robert Francis Darveaux | 2013-02-05 |
| 8319338 | Thin stacked interposer package | Christopher M. Scanlan | 2012-11-27 |
| 8299610 | Semiconductor device having RF shielding and method therefor | Christopher M. Scanlan | 2012-10-30 |
| 8283767 | Dual laminate package structure with embedded elements | — | 2012-10-09 |
| 8188584 | Direct-write wafer level chip scale package | Ronald Patrick Huemoeller, David Jon Hiner | 2012-05-29 |
| 7935516 | Surfactant biocatalyst for remediation of recalcitrant organics and heavy metals | Robin L. Brigmon, Sandra Story, Denis J. Altman | 2011-05-03 |
| 7915027 | Surfactant biocatalyst for remediation of recalcitrant organics and heavy metals | Robin L. Brigmon, Sandra Story, Denis J. Altman | 2011-03-29 |
| 7906315 | Surfactant biocatalyst for remediation of recalcitrant organics and heavy metals | Robin L. Brigmon, Sandra Story, Denis J. Altman | 2011-03-15 |
| 7898066 | Semiconductor device having EMI shielding and method therefor | Christopher M. Scanlan, Timothy L. Olson | 2011-03-01 |
| 7872343 | Dual laminate package structure with embedded elements | — | 2011-01-18 |
| 7859116 | Exposed metal bezel for use in sensor devices and method therefor | Michael Kelly, Christopher M. Scanlan | 2010-12-28 |
| 7829990 | Stackable semiconductor package including laminate interposer | Christopher M. Scanlan | 2010-11-09 |