Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057434 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Gi Jung Kim, Robert Lanzone, Jae Ung Lee +2 more | 2024-08-06 |
| 11488934 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Gi Jung Kim, Robert Lanzone, Jae Ung Lee +2 more | 2022-11-01 |
| 10872879 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Gi Jung Kim, Robert Lanzone, Jae Ung Lee +2 more | 2020-12-22 |
| 10163867 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Gi Jung Kim, Robert Lanzone, Jae Ung Lee +2 more | 2018-12-25 |
| 9875980 | Copper pillar sidewall protection | Glenn Rinne, Dean Zehnder, Christopher J. Berry, Robert Lanzone | 2018-01-23 |
| 8536462 | Flex circuit package and method | Robert Francis Darveaux, Marnie Ann Mattei, Timothy L. Olson | 2013-09-17 |
| 8338229 | Stackable plasma cleaned via package and method | Jin Seong Kim, Kurt Peter Wachtler | 2012-12-25 |
| 8300423 | Stackable treated via package and method | Robert Francis Darveaux, Akito Yoshida | 2012-10-30 |
| 7598598 | Offset etched corner leads for semiconductor package | Gregorio G. Dela Cruz, Fidelyn R. Canoy, Leocadio Morona Alabin | 2009-10-06 |
| 7485491 | Secure digital memory card using land grid array structure | Jeffrey Alan Miks | 2009-02-03 |
| 7112875 | Secure digital memory card using land grid array structure | Jeffrey Alan Miks | 2006-09-26 |
| 7008825 | Leadframe strip having enhanced testability | Leocadio Morona Alabin, Terry Davis, Ian Kent | 2006-03-07 |
| 6885086 | Reduced copper lead frame for saw-singulated chip package | Harry J. Fogelson, Gregorio G. Dela Cruz, Primitivo A. Palasi, William M. Anderson, Ahmer Syed | 2005-04-26 |
| 6847099 | Offset etched corner leads for semiconductor package | Gregorio G. Dela Cruz, Fidelyn R. Canoy, Leocadio Morona Alabin | 2005-01-25 |
| 6841414 | Saw and etch singulation method for a chip package | Tom Hu, Terry Davis, Won Dai Shin | 2005-01-11 |
| 6611047 | Semiconductor package with singulation crease | Tom Hu, Terry Davis | 2003-08-26 |
| 6608366 | Lead frame with plated end leads | Harry J. Fogelson, Ahmer Syed, Terry Davis, Primitivo A. Palasi, William M. Anderson | 2003-08-19 |
| 6339252 | Electronic device package and leadframe | Eulogia A. Niones, Nhun Thun Kham, Yeon Ho Choi, Sean T. Crowley | 2002-01-15 |
| 6258629 | Electronic device package and leadframe and method for making the package | Eulogia A. Niones, Nhun Thun Kham, Yeon Ho Choi, Sean T. Crowley | 2001-07-10 |
| 5370446 | Headrest with side supports | — | 1994-12-06 |