Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8314480 | Stackable semiconductor package with embedded die in pre-molded carrier frame | Manolito Galera, In-Suk Kim | 2012-11-20 |
| 8274145 | Semiconductor package system with patterned mask over thermal relief | Librado Gatbonton, Chiu Hsieh Ong, Beng Yee Teh, Antonio B. Dimaano, Jr. | 2012-09-25 |
| 8268671 | Semiconductor system-in-package and methods for making the same | Monolito Fabres Galera | 2012-09-18 |
| 8198132 | Isolated stacked die semiconductor packages | Manolito Galera | 2012-06-12 |
| 8072051 | Folded lands and vias for multichip semiconductor packages | Manolito Galera, In-Suk Kim | 2011-12-06 |
| 8053883 | Isolated stacked die semiconductor packages | Manolito Galera | 2011-11-08 |
| 7977776 | Multichip discrete package | Manolito Galera | 2011-07-12 |
| 7960211 | Semiconductor system-in-package and method for making the same | Manolito Galera | 2011-06-14 |
| 7944031 | Leadframe-based chip scale semiconductor packages | Manolito Galera | 2011-05-17 |
| 7923847 | Semiconductor system-in-a-package containing micro-layered lead frame | Manolito Galera | 2011-04-12 |
| 7888781 | Micro-layered lead frame semiconductor packages | Manolito Galera | 2011-02-15 |
| 7846773 | Multi-chip semiconductor package | Manolito Galera | 2010-12-07 |
| 7843048 | Multi-chip discrete devices in semiconductor packages | Manolito Galera | 2010-11-30 |
| 7598598 | Offset etched corner leads for semiconductor package | Ludovico E. Bancod, Gregorio G. Dela Cruz, Fidelyn R. Canoy | 2009-10-06 |
| 7498665 | Integrated circuit leadless package system | Il Kwon Shim, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2009-03-03 |
| 7008825 | Leadframe strip having enhanced testability | Ludovico E. Bancod, Terry Davis, Ian Kent | 2006-03-07 |
| 6847099 | Offset etched corner leads for semiconductor package | Ludovico E. Bancod, Gregorio G. Dela Cruz, Fidelyn R. Canoy | 2005-01-25 |