TD

Terry Davis

AT Amkor Technology: 12 patents #53 of 595Top 9%
Illinois Tool Works: 1 patents #2,292 of 4,258Top 55%
RC R Jennings Manufacturing Company: 1 patents #3 of 4Top 75%
Overall (All Time): #324,192 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8729682 Conformal shield on punch QFN semiconductor package Sun Jin Son 2014-05-20
7960818 Conformal shield on punch QFN semiconductor package Sun Jin Son 2011-06-14
7564122 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Chung Suk Han, Jae Hun Ku +2 more 2009-07-21
7473584 Method for fabricating a fan-in leadframe semiconductor package 2009-01-06
7217991 Fan-in leadframe semiconductor package 2007-05-15
7183630 Lead frame with plated end leads Harry J. Fogelson, Ludcvico Estrada Bancod, Ahmer Syed, Primitivo A. Palasi, William M. Anderson 2007-02-27
7057280 Leadframe having lead locks to secure leads to encapsulant Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Chung Suk Han, Jae Hun Ku +2 more 2006-06-06
7008825 Leadframe strip having enhanced testability Ludovico E. Bancod, Leocadio Morona Alabin, Ian Kent 2006-03-07
6841414 Saw and etch singulation method for a chip package Tom Hu, Ludovico E. Bancod, Won Dai Shin 2005-01-11
6825062 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Chung Suk Han, Jae Hun Ku +2 more 2004-11-30
6611047 Semiconductor package with singulation crease Tom Hu, Ludovico E. Bancod 2003-08-26
6608366 Lead frame with plated end leads Harry J. Fogelson, Ludovico E. Bancod, Ahmer Syed, Primitivo A. Palasi, William M. Anderson 2003-08-19
6448633 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Chung Suk Han, Jae Hun Ku +2 more 2002-09-10
5636745 Tray for a component and an apparatus for accurately placing a component within the tray Rodney Crisp, Stephen B. Van Ogle 1997-06-10
4907506 Method and apparatus for controlling spring rate and leverage in a screen printing device James P. Gates 1990-03-13