Terry Davis — 15 Patents at Amkor Technology

Terry Davis has been granted 15 US patents while listed as an inventor at Amkor Technology. The first was granted in 1990 and the most recent in May 2014. Terry Davis ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Terry Davis in Glens Falls, NY, US.

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8729682	Conformal shield on punch QFN semiconductor package	Sun Jin Son	2014-05-20	$6,669,000
7960818	Conformal shield on punch QFN semiconductor package	Sun Jin Son	2011-06-14	$3,111,000
7564122	Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant	Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Chung Suk Han, Jae Hun Ku +2 more	2009-07-21	$19,423,000
7473584	Method for fabricating a fan-in leadframe semiconductor package	—	2009-01-06	$9,329,000
7217991	Fan-in leadframe semiconductor package	—	2007-05-15	$34,921,000
7183630	Lead frame with plated end leads	Harry J. Fogelson, Ludcvico Estrada Bancod, Ahmer Syed, Primitivo A. Palasi, William M. Anderson	2007-02-27	$33,319,000
7057280	Leadframe having lead locks to secure leads to encapsulant	Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Chung Suk Han, Jae Hun Ku +2 more	2006-06-06	$11,269,000
7008825	Leadframe strip having enhanced testability	Ludovico E. Bancod, Leocadio Morona Alabin, Ian Kent	2006-03-07	$7,830,000
6841414	Saw and etch singulation method for a chip package	Tom Hu, Ludovico E. Bancod, Won Dai Shin	2005-01-11	$7,067,000
6825062	Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant	Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Chung Suk Han, Jae Hun Ku +2 more	2004-11-30	$16,623,000
6611047	Semiconductor package with singulation crease	Tom Hu, Ludovico E. Bancod	2003-08-26	$35,618,000
6608366	Lead frame with plated end leads	Harry J. Fogelson, Ludovico E. Bancod, Ahmer Syed, Primitivo A. Palasi, William M. Anderson	2003-08-19
6448633	Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant	Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Chung Suk Han, Jae Hun Ku +2 more	2002-09-10	$1,563,000
5636745	Tray for a component and an apparatus for accurately placing a component within the tray	Rodney Crisp, Stephen B. Van Ogle	1997-06-10	$29,426,000
4907506	Method and apparatus for controlling spring rate and leverage in a screen printing device	James P. Gates	1990-03-13

Terry Davis — 15 Patents

Issued Patents All Time

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