Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9202776 | Stackable multi-chip package system | — | 2015-12-01 |
| 8946878 | Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor | Chee Keong Chin, Yu Feng Feng, Frederick Cruz Santos | 2015-02-03 |
| 8937372 | Integrated circuit package system with molded strip protrusion | Junwoo Myung | 2015-01-20 |
| 8847413 | Integrated circuit package system with leads having multiple sides exposed | Byoung Wook Jang | 2014-09-30 |
| 8810019 | Integrated circuit package system with stacked die | Junwoo Myung, Byoung Wook Jang | 2014-08-19 |
| 8581382 | Integrated circuit packaging system with leadframe and method of manufacture thereof | Guo Qiang Shen, Feng Yao | 2013-11-12 |
| 8501540 | Method for manufacture of inline integrated circuit system | Junwoo Myung, Byoung Wook Jang, YoungChul Kim | 2013-08-06 |
| 8471374 | Integrated circuit package system with L-shaped leadfingers | Young Cheol Kim, Koo Hong Lee | 2013-06-25 |
| 8432026 | Stackable multi-chip package system | Koo Hong Lee | 2013-04-30 |
| 8207015 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | Guo Qiang Shen, Denver Zhu | 2012-06-26 |
| 8138591 | Integrated circuit package system with stacked die | Junwoo Myung, Byoung Wook Jang | 2012-03-20 |
| 8067272 | Integrated circuit package system for package stacking and manufacturing method thereof | Young Cheol Kim, Koo Hong Lee, II Kwon Shim | 2011-11-29 |
| 8018039 | Integrated circuit package system with stacked devices | Frederick Cruz Santos, Yong Yong Xia, Jun Xu | 2011-09-13 |
| 7968981 | Inline integrated circuit system | Junwoo Myung, Byoung Wook Jang, YoungChul Kim | 2011-06-28 |
| 7915738 | Stackable multi-chip package system with support structure | Young Cheol Kim, Koo Hong Lee | 2011-03-29 |
| 7645638 | Stackable multi-chip package system with support structure | Young Cheol Kim, Koo Hong Lee | 2010-01-12 |
| 7622333 | Integrated circuit package system for package stacking and manufacturing method thereof | Young Cheol Kim, Koo Hong Lee, Il Kwon Shim | 2009-11-24 |
| 7564122 | Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant | Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han, Jae Hun Ku +2 more | 2009-07-21 |
| 7057280 | Leadframe having lead locks to secure leads to encapsulant | Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han, Jae Hun Ku +2 more | 2006-06-06 |
| 6953988 | Semiconductor package | Seong Min Seo, Young Suk Chung, Jong Sik Paek, Jae Hun Ku | 2005-10-11 |
| 6876069 | Ground plane for exposed package | Jefferey D. Punzalan, Hien Boon Tan, Zheng Zheng, Byung Joon Han | 2005-04-05 |
| 6858919 | Semiconductor package | Seong Min Seo, Young Suk Chung, Jong Sik Paek, Jae Hun Ku | 2005-02-22 |
| 6825062 | Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant | Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han, Jae Hun Ku +2 more | 2004-11-30 |
| 6759737 | Semiconductor package including stacked chips with aligned input/output pads | Seong Min Seo, Young Suk Chung, Jong Sik Paek, Jae Hun Ku | 2004-07-06 |
| 6686258 | Method of trimming and singulating leaded semiconductor packages | — | 2004-02-03 |