Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6677663 | End grid array semiconductor package | Jae Hun Ku | 2004-01-13 |
| 6646339 | Thin and heat radiant semiconductor package and method for manufacturing | Jae Hun Ku | 2003-11-11 |
| 6630373 | Ground plane for exposed package | Jeffrey D. Punzalan, Hien Boon Tan, Zheng Zheng, Byung Joon Han | 2003-10-07 |
| 6627976 | Leadframe for semiconductor package and mold for molding the same | Young Suk Chung, Hyung Ju Lee | 2003-09-30 |
| 6555899 | Semiconductor package leadframe assembly and method of manufacture | Young Suk Chung, Sung Sik Jang | 2003-04-29 |
| 6525406 | Semiconductor device having increased moisture path and increased solder joint strength | Young Suk Chung, Sung Sik Jang, Jae Jin Lee, Tae Heon Lee, Hyung Ju Lee +3 more | 2003-02-25 |
| 6521987 | Plastic integrated circuit device package and method for making the package | Thomas P. Glenn, Scott Joseph Jewler, David Roman, Doo Hwan Moon | 2003-02-18 |
| 6483177 | Leaded semiconductor packages and method of trimming and singulating such packages | — | 2002-11-19 |
| 6448633 | Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant | Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han, Jae Hun Ku +2 more | 2002-09-10 |