Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7214326 | Increased capacity leadframe and semiconductor package using the same | Sung Jin Yang, Won Dai Shin | 2007-05-08 |
| 7144517 | Manufacturing method for leadframe and for semiconductor package using the leadframe | Sung Jin Yang | 2006-12-05 |
| 6977431 | Stackable semiconductor package and manufacturing method thereof | Kwang Seok Oh | 2005-12-20 |
| 6521987 | Plastic integrated circuit device package and method for making the package | Thomas P. Glenn, Scott Joseph Jewler, David Roman, Jae Hak Yee | 2003-02-18 |