Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7214326 | Increased capacity leadframe and semiconductor package using the same | Sung Jin Yang, Doo Hwan Moon | 2007-05-08 |
| 6841414 | Saw and etch singulation method for a chip package | Tom Hu, Terry Davis, Ludovico E. Bancod | 2005-01-11 |
| 6469258 | Circuit board for semiconductor package | Choon Heung Lee, Chang Hoon Ko, Won Sun Shin, Seon Goo Lee, Won Kyun Lee +2 more | 2002-10-22 |