| 7443039 |
System for different bond pads in an integrated circuit package |
Lun Zhao, Wan Lay Looi, Kyaw Oo Aung, Yonggang Jin, Jae Yong SONG |
2008-10-28 |
| RE40112 |
Semiconductor package and method for fabricating the same |
Do Sung Chun, Sang Ho Lee, Seon Goo Lee, Vincent DiCaprio |
2008-02-26 |
| 7306133 |
System for fabricating an integrated circuit package on a printed circuit board |
Yonggang Jin, Shelley Yong, Puay Gek Chua |
2007-12-11 |
| 7211900 |
Thin semiconductor package including stacked dies |
Do Sung Chun, Seon Goo Lee, Il Kwon Shim, Vincent DiCaprio |
2007-05-01 |
| 7190071 |
Semiconductor package and method for fabricating the same |
Seon Goo Lee, Do Sung Chun, Tae Hoan Jang, Vincent DiCaprio |
2007-03-13 |
| 7005370 |
Method of manufacturing different bond pads on the same substrate of an integrated circuit package |
Lun Zhao, Wan Lay Looi, Kyaw Oo Aung, Yonggang Jin, Jae Yong SONG |
2006-02-28 |
| 6982488 |
Semiconductor package and method for fabricating the same |
Do Sung Chun, Soon Goo Lee, Il Kwon Shim, Vincent DiCaprio |
2006-01-03 |
| 6940169 |
Torch bump |
Yong Jin |
2005-09-06 |
| 6798049 |
Semiconductor package and method for fabricating the same |
Do Sung Chun, Seon Goo Lee, Il Kwon Shim, Vincent DiCaprio |
2004-09-28 |
| 6740577 |
Method of forming a small pitch torch bump for mounting high-performance flip-flop devices |
Yong Jin |
2004-05-25 |
| 6717248 |
Semiconductor package and method for fabricating the same |
Seon Goo Lee, Do Sung Chun, Tae Hoan Jang, Vincent DiCaprio |
2004-04-06 |
| 6515356 |
Semiconductor package and method for fabricating the same |
Seon Goo Lee, Do Sung Chun, Tae Hoan Jang, Vincent DiCaprio |
2003-02-04 |
| 6469258 |
Circuit board for semiconductor package |
Choon Heung Lee, Won Dai Shin, Chang Hoon Ko, Seon Goo Lee, Won Kyun Lee +2 more |
2002-10-22 |
| 6150709 |
Grid array type lead frame having lead ends in different planes |
Byung Joon Han, Ju Hoon Yoon, Sung Bum Kwak, In Gyu Han |
2000-11-21 |
| 5866939 |
Lead end grid array semiconductor package |
Byung Joon Han, Ju Hoon Yoon, Sung Bum Kwak, In Gyu Han |
1999-02-02 |
| 5854511 |
Semiconductor package including heat sink with layered conductive plate and non-conductive tape bonding to leads |
Won Kyun Lee |
1998-12-29 |
| 5807768 |
Method for fabricating a heat sink-integrated semiconductor package |
— |
1998-09-15 |
| 5723899 |
Semiconductor lead frame having connection bar and guide rings |
— |
1998-03-03 |
| 5629561 |
Semiconductor package with integral heat dissipator |
Byung Tai Do |
1997-05-13 |